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<p>Multilayer ceramic capacitors (MLCCs) are essential passive components in electronic circuits. Driven by the relentless pursuit of device miniaturization and high volumetric capacitance, MLCC architectures are evolving toward aggressively thinned dielectric layers and massive layer stacking. However, ensuring operational stability under these extreme conditions has emerged as a paramount challenge. Here, we systematically investigate the impact of nickel inner electrode particle size (150, 200, and 300&#xa0;nm) on the reliability and failure mechanisms of MLCCs. While the fundamental dielectric response and temperature stability remained insensitive to electrode granulometry, the device reliability exhibited a strong size dependence. Specifically, MLCCs fabricated with 300&#xa0;nm BaTiO<sub>3</sub> dielectric material combined with 200&#xa0;nm Ni powder demonstrated superior resistance to degradation, characterized by enhanced DC-bias performance, high-temperature insulation resistance, and extended time-to-failure (TTF). This enhanced reliability is attributed to an optimized electrode–-dielectric interface: the 200&#xa0;nm Ni configuration yielded an interface resistance approximately 35% higher than comparative groups and a Schottky barrier height of 1.20&#xa0;eV—approaching the theoretical limit of 1.25&#xa0;eV. These findings establish a critical design criterion for electrode–dielectric matching, paving the way for next-generation high-capacity, high-reliability MLCCs.</p>

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The influence of nickel internal electrodes on the reliability of barium titanate-based multilayer ceramic capacitors

  • 期刊论文

  • 发表日期：

    2026年7月2日

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  • Xinghuan Chen,
  • Meijuan Li,
  • Bin Zhou,
  • Shuai Chen,
  • Yu Lu,
  • Genshui Wang,
  • Guoqiang Luo,
  • Qinqin Wei,
  • Yonghong Chen,
  • Yongchang Zhou,
  • Yaoquan Mao,
  • Xuefeng Chen

摘要

Multilayer ceramic capacitors (MLCCs) are essential passive components in electronic circuits. Driven by the relentless pursuit of device miniaturization and high volumetric capacitance, MLCC architectures are evolving toward aggressively thinned dielectric layers and massive layer stacking. However, ensuring operational stability under these extreme conditions has emerged as a paramount challenge. Here, we systematically investigate the impact of nickel inner electrode particle size (150, 200, and 300 nm) on the reliability and failure mechanisms of MLCCs. While the fundamental dielectric response and temperature stability remained insensitive to electrode granulometry, the device reliability exhibited a strong size dependence. Specifically, MLCCs fabricated with 300 nm BaTiO3 dielectric material combined with 200 nm Ni powder demonstrated superior resistance to degradation, characterized by enhanced DC-bias performance, high-temperature insulation resistance, and extended time-to-failure (TTF). This enhanced reliability is attributed to an optimized electrode–-dielectric interface: the 200 nm Ni configuration yielded an interface resistance approximately 35% higher than comparative groups and a Schottky barrier height of 1.20 eV—approaching the theoretical limit of 1.25 eV. These findings establish a critical design criterion for electrode–dielectric matching, paving the way for next-generation high-capacity, high-reliability MLCCs.