Magnetic, EMI shielding, thermal conductivity, and mechanical behavior of surface-modified canabo fiber and macadamia shell biocarbon-reinforced vinyl ester composites with copper ferrite nanoparticles
摘要
The present study investigates the development and multifunctional performance of surface-modified Canabo fiber and macadamia shell biocarbon-reinforced vinyl ester composites incorporated with copper ferrite nanoparticles for electromagnetic interference (EMI) shielding applications. The composites were fabricated using a hand layup technique with varying filler concentrations ranging from 0 to 2 vol.% of hybrid fillers while maintaining 40-vol.% Canabo mat fiber reinforcement. Mechanical characterization revealed that the optimized composite V12 exhibited the highest tensile strength of 148 MPa, flexural strength of 198 MPa, impact toughness of 5.8 J, and hardness of 91 Shore D, corresponding to improvements of 55.8, 32, 93, and 16.7, respectively, compared with the neat vinyl ester composite. Thermal conductivity increased from 0.23 for V to 0.46 W/m·K for V14, representing nearly 100% enhancement due to improved heat transfer pathways created by hybrid fillers. Magnetic permeability analysis demonstrated increased magnetic response, where μ′ increased from 1.45 to 1.75 and μ″ peak increased from 0.17 to 0.26, confirming enhanced magnetic loss behavior. Dielectric analysis showed significant improvements, with the dielectric constant increasing from 3.2 to 5.3 (65.6% increase) and dielectric loss increasing from 0.11 to 0.27 (145% increase). The EMI shielding performance improved substantially, where the optimized composite V14 exhibited a total shielding effectiveness of approximately 49 dB at 20 GHz, dominated by absorption mechanisms. The synergistic combination of dielectric polarization from biocarbon and magnetic loss from copper ferrite nanoparticles significantly enhanced electromagnetic wave attenuation. The developed hybrid composites demonstrate excellent potential for high-frequency EMI shielding applications in electronic devices and communication systems.