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<p>As electronic devices become increasingly high-power and highly integrated, thermal management has emerged as a critical factor limiting their reliability. To address the poor interfacial compatibility and processability caused by traditional high-thermal-conductivity fillers, this study adopts an industry-friendly strategy. Commercial silane coupling agents were used to surface-modify nano-hexagonal boron nitride (h-BN), followed by physical blending to prepare epoxy composites. Systematic investigations show that this modification improves filler dispersion and paste flowability. More importantly, multiscale thermal conductivity modeling reveals that surface modification enhances thermal transport by promoting thermal conduction pathways and reducing interfacial thermal resistance. The modification also reduces phonon scattering at interfaces through strengthened interfacial bonding. Meanwhile, the insulation and dielectric properties of the composites are well preserved. This work provides experimental evidence and mechanistic insights for developing high-performance, easily processable thermal interface materials.</p>

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Achieving high-performance thermally conductive yet electrically insulating epoxy composites through nano-BN interface engineering

  • 期刊论文

  • 发表日期：

    2026年6月26日

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  • Weizhuo Li,
  • Xuan Wang,
  • Mingzhe Qu,
  • Miaomiao Cui,
  • Zhanyi Wang

摘要

As electronic devices become increasingly high-power and highly integrated, thermal management has emerged as a critical factor limiting their reliability. To address the poor interfacial compatibility and processability caused by traditional high-thermal-conductivity fillers, this study adopts an industry-friendly strategy. Commercial silane coupling agents were used to surface-modify nano-hexagonal boron nitride (h-BN), followed by physical blending to prepare epoxy composites. Systematic investigations show that this modification improves filler dispersion and paste flowability. More importantly, multiscale thermal conductivity modeling reveals that surface modification enhances thermal transport by promoting thermal conduction pathways and reducing interfacial thermal resistance. The modification also reduces phonon scattering at interfaces through strengthened interfacial bonding. Meanwhile, the insulation and dielectric properties of the composites are well preserved. This work provides experimental evidence and mechanistic insights for developing high-performance, easily processable thermal interface materials.