<p>Wide-bandgap semiconductors are extensively studied and applied in the field of power devices, presenting challenges to the high-temperature reliability of interconnect materials. Micro/nano-silver paste, as an alternative to high-temperature solders, has been progressively adopted for interconnection in power devices. However, due to the lack of research on the quantitative sintering kinetics of micro/nano-silver joints, flexibly adjusting their sintering process lacks theoretical guidance. The sintering kinetics of micro/nano-silver joints are influenced by multiple factors. To characterize the relationship among sintering temperature, sintering durations, and sintering completion, this paper proposed a semi-quantitative calculation method based on the integral of diffusion flux over time. This approach was built upon the observation that surface diffusion dominates as the primary mass transport mechanism during the early-stage sintering of silver paste. Thus, a sintering kinetic theory for the silver joint system is established. In the same sintering system, sintering processes that result in identical integrated diffusion flux values demonstrate equivalence, leading to silver joints with consistent performance and microstructural characteristics. This method can be applied to various sintering systems, including silver flakes and/or silver spheres pastes on different substrates. Based on this proposed sintering kinetics, we developed a reflow sintering process for a silver joint system. This enables either rapid sintering or ultra-low-temperature sintering preparation of silver joints, providing a quantitative assessment theory for achieving sintering of micro/nano-silver joints under diverse conditions.</p>