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<p>To enhance the comprehensive properties of lead-free solders, this study systematically investigated the effects of In (2, 4, 6 wt.%) and Ag (1, 2, 3 wt.%) additions on the microstructural evolution, interfacial intermetallic compound (IMC) growth kinetics, and mechanical properties of Sn-based solder joints. The results revealed distinct strengthening mechanisms for In and Ag. For Sn-xIn/Cu joints, In significantly accelerated interfacial reactions, promoting the thickening of the Cu<sub>6</sub>Sn<sub>5</sub> IMC layer and coarsening of the γ-(Sn, In) phase. This behavior was attributed to In atoms occupying interstitial sites in the Sn matrix, thereby reducing the diffusion activation energy of Sn atoms. In contrast, for Sn-xAg/Cu joints, Ag primarily enhanced initial shear strength through precipitation strengthening, grain refinement, and Cu diffusion inhibition, facilitated by the formation of dense Ag<sub>3</sub>Sn particles. During thermal aging, the morphological evolution and coarsening of Ag<sub>3</sub>Sn critically influenced long-term joint reliability. Mechanistically, In synergistically improved shear strength and fracture energy via solid solution strengthening and grain refinement, whereas Ag’s effects were dominated by precipitation strengthening and diffusion barrier formation. This study elucidates the distinct roles of In and Ag in Sn-based solders, providing theoretical insights and experimental guidance for designing high-performance, high-reliability multi-component lead-free solder alloys.</p>

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Effects of indium and silver additions on the microstructural evolution and shear strength reliability of Sn-based solder/Cu joints

  • 期刊论文

  • 发表日期：

    2026年5月16日

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  • Huixuan Liu,
  • Rongsheng Ji,
  • Jiayu Zhang,
  • Han Yan,
  • Mingqing Liao,
  • Rongmei Zhang,
  • Fengjiang Wang

摘要

To enhance the comprehensive properties of lead-free solders, this study systematically investigated the effects of In (2, 4, 6 wt.%) and Ag (1, 2, 3 wt.%) additions on the microstructural evolution, interfacial intermetallic compound (IMC) growth kinetics, and mechanical properties of Sn-based solder joints. The results revealed distinct strengthening mechanisms for In and Ag. For Sn-xIn/Cu joints, In significantly accelerated interfacial reactions, promoting the thickening of the Cu6Sn5 IMC layer and coarsening of the γ-(Sn, In) phase. This behavior was attributed to In atoms occupying interstitial sites in the Sn matrix, thereby reducing the diffusion activation energy of Sn atoms. In contrast, for Sn-xAg/Cu joints, Ag primarily enhanced initial shear strength through precipitation strengthening, grain refinement, and Cu diffusion inhibition, facilitated by the formation of dense Ag3Sn particles. During thermal aging, the morphological evolution and coarsening of Ag3Sn critically influenced long-term joint reliability. Mechanistically, In synergistically improved shear strength and fracture energy via solid solution strengthening and grain refinement, whereas Ag’s effects were dominated by precipitation strengthening and diffusion barrier formation. This study elucidates the distinct roles of In and Ag in Sn-based solders, providing theoretical insights and experimental guidance for designing high-performance, high-reliability multi-component lead-free solder alloys.