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<p>The accurate prediction of electromigration (EM)-induced cathode dissolution remains a challenge for the reliability assessment of fine-pitch solder joints. Conventional models, which assume a diagonal current path and a nominal current density, fail to accurately predict cathode dissolution rates. This study addresses the assumption of a diagonal current direction as a primary limitation and proposes a corrected model for the atomic EM diffusion flux, which incorporates both the direction and magnitude of the local current vector at the cathode electron entrance, obtained from finite element simulations. By integrating the local current vector field with <i>β–</i>Sn grain orientation data, the model enables a precise calculation of the atomic diffusion flux for predicting EM failure of solder joints. Model validation demonstrates exceptional agreement between the predicted and experimental dissolution rates, significantly outperforming conventional methods. The model reveals that the dissolution rate is governed by the acute angle between the local current vector and the c-axis of the <i>β</i>-Sn grain, but not by the angle defined by the conventional diagonal assumption. This work provides a reliable tool for predicting EM-induced failure and offers a critical theoretical basis for designing high-reliability solder interconnects.</p>

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A vector-based model for electromigration: integrating local current and anisotropy for accurate cathode dissolution prediction

  • 期刊论文

  • 发表日期：

    2026年4月22日

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  • H. L. Liu,
  • S. Meng,
  • S. B. Wang,
  • M. L. Huang

摘要

The accurate prediction of electromigration (EM)-induced cathode dissolution remains a challenge for the reliability assessment of fine-pitch solder joints. Conventional models, which assume a diagonal current path and a nominal current density, fail to accurately predict cathode dissolution rates. This study addresses the assumption of a diagonal current direction as a primary limitation and proposes a corrected model for the atomic EM diffusion flux, which incorporates both the direction and magnitude of the local current vector at the cathode electron entrance, obtained from finite element simulations. By integrating the local current vector field with β–Sn grain orientation data, the model enables a precise calculation of the atomic diffusion flux for predicting EM failure of solder joints. Model validation demonstrates exceptional agreement between the predicted and experimental dissolution rates, significantly outperforming conventional methods. The model reveals that the dissolution rate is governed by the acute angle between the local current vector and the c-axis of the β-Sn grain, but not by the angle defined by the conventional diagonal assumption. This work provides a reliable tool for predicting EM-induced failure and offers a critical theoretical basis for designing high-reliability solder interconnects.