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<p>The continuous increase in power density and packaging density of electronic devices has imposed stringent requirements on thermal interface materials (TIMs) to deliver high thermal conductivity, electrical insulation, processability, and long-term reliability. In this study, an hBN-rich hybrid TIM is developed by integrating graphene oxide (GO), zinc oxide (ZnO), silicon carbide (SiC), and hexagonal boron nitride (hBN) within a silicone matrix without employing silane-based surface modification. The formulation strategy relies on multi-dimensional filler synergy to construct efficient heat-conduction networks while preserving dielectric integrity. The optimized hybrid composition (12 wt % GO, 18 wt % ZnO, 30 wt % SiC and 40 wt % hBN) achieved an effective thermal conductivity of ~ 5.8 W&#xa0;m⁻<sup>1</sup>&#xa0;K⁻<sup>1</sup>, representing a ~ 45–65% improvement over commercial silicone-based TIMs, together with a low interfacial thermal resistance of ~ 0.18&#xa0;K&#xa0;cm<sup>2</sup>&#xa0;W⁻<sup>1</sup> at a controlled bond-line thickness of 120 ± 30&#xa0;<i>μ</i>m. Thermogravimetric analysis indicates good thermal stability, with an onset decomposition temperature of ~ 420&#xa0;°C and residual mass exceeding 75 wt % at 600&#xa0;°C. After thermal cycling between 25 and 100&#xa0;°C for 50 cycles, the TIMs retained more than 95% of their initial thermal performance, indicating stable interfacial contact during repeated thermal loading. System-level validation using a 50 W chip-on-board LED module demonstrated a junction temperature reduction of ~ 8–10&#xa0;°C compared with a commercial thermal paste, leading to an 8–12% improvement in luminous efficacy, luminous-flux degradation below 4%, and correlated color temperature stability within ± 50&#xa0;K. These results indicate that the synergistic hybrid filler architecture enables balanced thermal, electrical, and reliability performance, highlighting the potential of hBN-rich hybrid TIMs for high-power LEDs, CPUs, power electronics, and advanced electronic packaging.</p>

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hBN-rich graphene oxide–based hybrid thermal interface materials for enhanced insulation and thermal stability in electronic packaging

  • 期刊论文

  • 发表日期：

    2026年4月24日

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  • Asokan Bakhirathan,
  • Jesudass S Thomas,
  • Sathish Thanikodi,
  • Subramani NarayanaSarma

摘要

The continuous increase in power density and packaging density of electronic devices has imposed stringent requirements on thermal interface materials (TIMs) to deliver high thermal conductivity, electrical insulation, processability, and long-term reliability. In this study, an hBN-rich hybrid TIM is developed by integrating graphene oxide (GO), zinc oxide (ZnO), silicon carbide (SiC), and hexagonal boron nitride (hBN) within a silicone matrix without employing silane-based surface modification. The formulation strategy relies on multi-dimensional filler synergy to construct efficient heat-conduction networks while preserving dielectric integrity. The optimized hybrid composition (12 wt % GO, 18 wt % ZnO, 30 wt % SiC and 40 wt % hBN) achieved an effective thermal conductivity of ~ 5.8 W m⁻1 K⁻1, representing a ~ 45–65% improvement over commercial silicone-based TIMs, together with a low interfacial thermal resistance of ~ 0.18 K cm2 W⁻1 at a controlled bond-line thickness of 120 ± 30 μm. Thermogravimetric analysis indicates good thermal stability, with an onset decomposition temperature of ~ 420 °C and residual mass exceeding 75 wt % at 600 °C. After thermal cycling between 25 and 100 °C for 50 cycles, the TIMs retained more than 95% of their initial thermal performance, indicating stable interfacial contact during repeated thermal loading. System-level validation using a 50 W chip-on-board LED module demonstrated a junction temperature reduction of ~ 8–10 °C compared with a commercial thermal paste, leading to an 8–12% improvement in luminous efficacy, luminous-flux degradation below 4%, and correlated color temperature stability within ± 50 K. These results indicate that the synergistic hybrid filler architecture enables balanced thermal, electrical, and reliability performance, highlighting the potential of hBN-rich hybrid TIMs for high-power LEDs, CPUs, power electronics, and advanced electronic packaging.