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<p>The effects of adding silver-coated copper (Ag@Cu) particles on the melting point, microstructure, and shear strength of Sn58Bi/Cu solder joints before and after thermal aging were investigated. Composite solders containing different mass fractions (0, 0.1, 0.2, 0.5, 1.0, and 2.0 wt%) of Ag@Cu particles were prepared using a mechanical stirring method. The results indicate that the addition of Ag@Cu particles refines the microstructure, suppresses the growth of the intermetallic compound (IMC) layers, and improves the mechanical properties of Sn58Bi/Cu solder joints. The incorporation of Ag@Cu has little effect on the melting point of the composite solder. Before thermal aging, compared to the Sn58Bi/Cu solder joints, the Sn58Bi–0.5Ag@Cu/Cu solder joints exhibited the highest shear strength of 55.603&#xa0;MPa. After 600&#xa0;h of thermal aging, the growth rate of IMC layers for the Sn8Bi–1.0Ag@Cu/Cu solder joints decreased by 33.125% compared with that of the Sn58Bi/Cu solder joints. The strength of composite solder joints decreased with the prolonged aging time, and the shear strength of Sn58Bi–1.0Ag@Cu/Cu solder joint was best, which was 49.414&#xa0;MPa. When the Ag@Cu content reached 2.0 wt%, the particles could not disperse effectively and tended to agglomerate locally, leading to excessive Sn consumption and the formation of extended Bi-rich regions around Ag@Cu particles, which resulted in a coarsened microstructure and decreased shear strength. Therefore, adding an optimum content of Ag@Cu particles can improve the shear strength and thermal aging performance of Sn58Bi/Cu solder joints.</p>

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Interfacial reaction behavior, microstructure, and shear property of Sn58Bi–xAg@Cu/Cu solder joints during thermal aging

  • 期刊论文

  • 发表日期：

    2026年3月19日

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  • Zuchen Liu,
  • Xiangxia Kong,
  • Lu Yang,
  • Junjun Zhai,
  • Zhen Pan,
  • Xuemei Li

摘要

The effects of adding silver-coated copper (Ag@Cu) particles on the melting point, microstructure, and shear strength of Sn58Bi/Cu solder joints before and after thermal aging were investigated. Composite solders containing different mass fractions (0, 0.1, 0.2, 0.5, 1.0, and 2.0 wt%) of Ag@Cu particles were prepared using a mechanical stirring method. The results indicate that the addition of Ag@Cu particles refines the microstructure, suppresses the growth of the intermetallic compound (IMC) layers, and improves the mechanical properties of Sn58Bi/Cu solder joints. The incorporation of Ag@Cu has little effect on the melting point of the composite solder. Before thermal aging, compared to the Sn58Bi/Cu solder joints, the Sn58Bi–0.5Ag@Cu/Cu solder joints exhibited the highest shear strength of 55.603 MPa. After 600 h of thermal aging, the growth rate of IMC layers for the Sn8Bi–1.0Ag@Cu/Cu solder joints decreased by 33.125% compared with that of the Sn58Bi/Cu solder joints. The strength of composite solder joints decreased with the prolonged aging time, and the shear strength of Sn58Bi–1.0Ag@Cu/Cu solder joint was best, which was 49.414 MPa. When the Ag@Cu content reached 2.0 wt%, the particles could not disperse effectively and tended to agglomerate locally, leading to excessive Sn consumption and the formation of extended Bi-rich regions around Ag@Cu particles, which resulted in a coarsened microstructure and decreased shear strength. Therefore, adding an optimum content of Ag@Cu particles can improve the shear strength and thermal aging performance of Sn58Bi/Cu solder joints.