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<p>This study developed In–Sn based low-temperature solders with enhanced strength by constructing novel interfacial phases between tetragonal ZnO whiskers (T-ZnOw) and an In–45.6Sn–5Bi (ISB) solder matrix. The effects of Ni-coated T-ZnOw (Ni@T-ZnOw) and NiO-coated T-ZnOw (NiO@T-ZnOw) on the microstructure and mechanical properties of ISB solder alloys and their joints were systematically investigated. Results indicate that the ISB-NiO@T-ZnOw composite solder achieved the most substantial microstructural refinement, demonstrating superior effectiveness compared to the Ni@T-ZnOw reinforced composite. The optimized interfacial bonding is attributed to the low lattice mismatch at the NiO@T-ZnOw/β-phase interface. This refined microstructure and enhanced interface quality improved the shear strength of solder joints, with the ISB-NiO@T-ZnOw/Cu joint reaching 19.56 MPa, 1.67 times higher than the ISB-Ni@T-ZnOw/Cu joint. Fracture analysis identified grain refinement and load transfer as the primary strengthening mechanisms. This research provides valuable insights for designing high-performance composite solders for electronic packaging and microelectronics applications.</p>

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Achieving enhanced strength in tetragonal ZnO whiskers reinforced In-45.6Sn-5Bi composite solder via NiO coating

  • 期刊论文

  • 发表日期：

    2026年3月21日

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  • Lingmin Ye,
  • Xiaodong Li,
  • Mu Zhang,
  • Qi zhu,
  • Xudong Sun

摘要

This study developed In–Sn based low-temperature solders with enhanced strength by constructing novel interfacial phases between tetragonal ZnO whiskers (T-ZnOw) and an In–45.6Sn–5Bi (ISB) solder matrix. The effects of Ni-coated T-ZnOw (Ni@T-ZnOw) and NiO-coated T-ZnOw (NiO@T-ZnOw) on the microstructure and mechanical properties of ISB solder alloys and their joints were systematically investigated. Results indicate that the ISB-NiO@T-ZnOw composite solder achieved the most substantial microstructural refinement, demonstrating superior effectiveness compared to the Ni@T-ZnOw reinforced composite. The optimized interfacial bonding is attributed to the low lattice mismatch at the NiO@T-ZnOw/β-phase interface. This refined microstructure and enhanced interface quality improved the shear strength of solder joints, with the ISB-NiO@T-ZnOw/Cu joint reaching 19.56 MPa, 1.67 times higher than the ISB-Ni@T-ZnOw/Cu joint. Fracture analysis identified grain refinement and load transfer as the primary strengthening mechanisms. This research provides valuable insights for designing high-performance composite solders for electronic packaging and microelectronics applications.