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<p>The reliability of Sn58Bi solder has diminished due to the coarsening and segregation of the Bi phase. This study aims to enhance the inherent low mechanical properties and brittleness of Sn58Bi solder. This study proposes a solution for preparing flake Sn58Bi and SAC305 solder powders of different thicknesses by ball milling, and, based on this, to prepare low-temperature composite solder paste. The research findings indicate that the lamellar structure facilitates the rapid and uniform melting and mixing of solid and liquid phases at low temperatures due to its high specific surface area. This structure enhances the distribution of the Bi phase through its melting and spreading behavior. When the thickness of flake Sn58Bi is 7–8&#xa0;μm and that of SAC305 is 9–10&#xa0;μm, the composite solder paste, formulated at a mass ratio of 63:37, achieves optimal comprehensive performance, with a melting range of 140–143&#xa0;°C. When subjected to low-temperature soldering at 170&#xa0;°C for 1&#xa0;min, the wetting angle decreases to 35.68°, and the spreading rate increases to 82.9%. Fine Bi phases (particles smaller than 2 μm<sup>2</sup>, comprising up to 83.6%) are evenly dispersed within the solder joints. Simultaneously, a uniform scallop-shaped IMC layer, 0.84&#xa0;μm thick, is generated at the interface. This study proposes a method for preparing a highly reliable low-temperature composite solder, offering a novel approach for its development.</p>

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Study on Sn58Bi/SAC305 low-temperature composite solder paste based on flake solder and its soldering performance

  • 期刊论文

  • 发表日期：

    2026年3月17日

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  • WenLong Yang,
  • Min Shang,
  • ChenYu Li,
  • JingLi Ke,
  • Han Sun,
  • Jie Yu,
  • HaiTao Ma

摘要

The reliability of Sn58Bi solder has diminished due to the coarsening and segregation of the Bi phase. This study aims to enhance the inherent low mechanical properties and brittleness of Sn58Bi solder. This study proposes a solution for preparing flake Sn58Bi and SAC305 solder powders of different thicknesses by ball milling, and, based on this, to prepare low-temperature composite solder paste. The research findings indicate that the lamellar structure facilitates the rapid and uniform melting and mixing of solid and liquid phases at low temperatures due to its high specific surface area. This structure enhances the distribution of the Bi phase through its melting and spreading behavior. When the thickness of flake Sn58Bi is 7–8 μm and that of SAC305 is 9–10 μm, the composite solder paste, formulated at a mass ratio of 63:37, achieves optimal comprehensive performance, with a melting range of 140–143 °C. When subjected to low-temperature soldering at 170 °C for 1 min, the wetting angle decreases to 35.68°, and the spreading rate increases to 82.9%. Fine Bi phases (particles smaller than 2 μm2, comprising up to 83.6%) are evenly dispersed within the solder joints. Simultaneously, a uniform scallop-shaped IMC layer, 0.84 μm thick, is generated at the interface. This study proposes a method for preparing a highly reliable low-temperature composite solder, offering a novel approach for its development.