Scholarlink

<p>In this study, the influence of tungsten (W) nanoparticles (NPs) on the wetting, spreading, microstructure, thermal, electrical, mechanical, and aging study of low-temperature Sn–57 wt% solder was investigated. The W NPs were added at various contents (<i>x</i> = 0, 0.05, 0.1, 0.3, and 0.5wt%) to the Sn–57 wt% Bi solder using the melting and casting route and used to bond electroless nickel immersion gold (ENIG) Cu pad joint. A Field Emission Scanning Electron Microscope (FE-SEM) and an Energy Dispersive X-ray Spectrometer (EDS) were utilized to study the changes in morphology of the β-Sn and Bi-phases. The intermetallic compounds (IMC) thickness of Sn–Bi–<i>x</i>W/Cu joints was measured after aging for 0, 50, and 100&#xa0;h at 80&#xa0;°C. The findings showed that the pristine Sn–57Bi coarse IMCs gradually became thin after the addition of W NPs up to 0.3 wt%. Furthermore, it was established that the inclusion of W NPs did not affect Sn–57Bi melting point, indicating that it was appropriate for use as a low-temperature solder. A superior spreadability (72.3%) of the Sn–57Bi–0.3W sample was validated. The Zero Cross Time (ZCT) was reduced to 1.27&#xa0;s demonstrating outstanding solderability. The tensile strength of the Sn–57Bi–<i>x</i>W was enhanced for all the composite samples as compared to the pristine Sn–57Bi sample. However, the elongation was maximum ~ 100% for the Sn–57Bi–0.3 W sample. The aging studies showed increased IMCs growth, which followed a parabolic rate law. There are a few dimples in the tensile fracture of Sn–57Bi–0.3W solder, and the brittle fracture mode was evident in the fracture surface morphologies of Sn–57Bi–<i>x</i>W (<i>x</i> = 0–0.5 wt%) solder joints. The best outcome of solder joint reliability was achieved at 0.3 wt% W NPs, confirming its suitability as a next-generation solder for flexible electronics.</p>

错误：搜索内容不能为空，请输入英文关键词
错误：关键词超出字数限制，请精简
高级检索

Mechanistic insights into the interfacial and plastic behavior of nano-tungsten reinforced Sn–Bi lead-free alloys

  • 期刊论文

  • 发表日期：

    2026年3月3日

查看全文
  • Jaeyeon Yi,
  • Jiwan Kang,
  • Sri Harini Rajendran,
  • Jae Pil Jung,
  • Ashutosh Sharma,
  • Hyun-Sik Kim

摘要

In this study, the influence of tungsten (W) nanoparticles (NPs) on the wetting, spreading, microstructure, thermal, electrical, mechanical, and aging study of low-temperature Sn–57 wt% solder was investigated. The W NPs were added at various contents (x = 0, 0.05, 0.1, 0.3, and 0.5wt%) to the Sn–57 wt% Bi solder using the melting and casting route and used to bond electroless nickel immersion gold (ENIG) Cu pad joint. A Field Emission Scanning Electron Microscope (FE-SEM) and an Energy Dispersive X-ray Spectrometer (EDS) were utilized to study the changes in morphology of the β-Sn and Bi-phases. The intermetallic compounds (IMC) thickness of Sn–Bi–xW/Cu joints was measured after aging for 0, 50, and 100 h at 80 °C. The findings showed that the pristine Sn–57Bi coarse IMCs gradually became thin after the addition of W NPs up to 0.3 wt%. Furthermore, it was established that the inclusion of W NPs did not affect Sn–57Bi melting point, indicating that it was appropriate for use as a low-temperature solder. A superior spreadability (72.3%) of the Sn–57Bi–0.3W sample was validated. The Zero Cross Time (ZCT) was reduced to 1.27 s demonstrating outstanding solderability. The tensile strength of the Sn–57Bi–xW was enhanced for all the composite samples as compared to the pristine Sn–57Bi sample. However, the elongation was maximum ~ 100% for the Sn–57Bi–0.3 W sample. The aging studies showed increased IMCs growth, which followed a parabolic rate law. There are a few dimples in the tensile fracture of Sn–57Bi–0.3W solder, and the brittle fracture mode was evident in the fracture surface morphologies of Sn–57Bi–xW (x = 0–0.5 wt%) solder joints. The best outcome of solder joint reliability was achieved at 0.3 wt% W NPs, confirming its suitability as a next-generation solder for flexible electronics.