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<p>Flexible transparent conductive thin films (TCFs) based on copper nanowires (Cu NWs) offer a low-cost and earth-abundant alternative to ITO, yet their practical adoption remains severely constrained by oxidation, weak interfacial adhesion, and optical losses. Here, we demonstrate a high-performance Al<sub>2</sub>O<sub>3</sub>/Cu NWs/Al<sub>2</sub>O<sub>3</sub> (ACA) sandwich architecture that simultaneously enhances transparency, conductivity, mechanical robustness, and environmental stability. Ultrathin sputtered Al<sub>2</sub>O<sub>3</sub> layers act as multifunctional dielectric interfaces that (i) suppress optical reflection and improve light transmission through refractive-index matching, (ii) mechanically lock Cu NW junctions to prevent slippage and fracture under strain, and (iii) provide conformal, diffusion-blocking encapsulation that inhibits moisture − , oxygen − , Cl⁻-, and peroxide-induced corrosion. As a result, the ACA based TCFs achieve 27.1 Ω/sq at 87.7% transmittance, a figure of merit surpassing pristine Cu NW networks. The TCFs sustain &lt; 3% resistance change at a 5&#xa0;mm bending radius, remain stable through &gt; 50 tape-peeling cycles and 60&#xa0;s of ultrasonication, and exhibit dramatically improved durability under accelerated aging, including 85&#xa0;°C/85% RH exposure, ultraviolet-ozone oxidation, NaCl corrosion, and H<sub>2</sub>O<sub>2</sub> attack. This work establishes a scalable and substrate-compatible strategy for fabricating low-cost, oxidation-resistant, and mechanically resilient Cu-based TCFs, enabling reliable integration into next-generation flexible optoelectronics.</p>

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Al2O3/Cu nanowire/Al2O3 sandwich architecture for high-performance flexible transparent conductive thin films

  • 期刊论文

  • 发表日期：

    2026年2月9日

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  • Juntang Li,
  • Zhuo Li,
  • Qingchen Dong,
  • Shihui Yu

摘要

Flexible transparent conductive thin films (TCFs) based on copper nanowires (Cu NWs) offer a low-cost and earth-abundant alternative to ITO, yet their practical adoption remains severely constrained by oxidation, weak interfacial adhesion, and optical losses. Here, we demonstrate a high-performance Al2O3/Cu NWs/Al2O3 (ACA) sandwich architecture that simultaneously enhances transparency, conductivity, mechanical robustness, and environmental stability. Ultrathin sputtered Al2O3 layers act as multifunctional dielectric interfaces that (i) suppress optical reflection and improve light transmission through refractive-index matching, (ii) mechanically lock Cu NW junctions to prevent slippage and fracture under strain, and (iii) provide conformal, diffusion-blocking encapsulation that inhibits moisture − , oxygen − , Cl⁻-, and peroxide-induced corrosion. As a result, the ACA based TCFs achieve 27.1 Ω/sq at 87.7% transmittance, a figure of merit surpassing pristine Cu NW networks. The TCFs sustain < 3% resistance change at a 5 mm bending radius, remain stable through > 50 tape-peeling cycles and 60 s of ultrasonication, and exhibit dramatically improved durability under accelerated aging, including 85 °C/85% RH exposure, ultraviolet-ozone oxidation, NaCl corrosion, and H2O2 attack. This work establishes a scalable and substrate-compatible strategy for fabricating low-cost, oxidation-resistant, and mechanically resilient Cu-based TCFs, enabling reliable integration into next-generation flexible optoelectronics.