The effect of germanium on microstructure and mechanical properties of Sn–58Bi–5In alloy
摘要
In this paper, the effects of xGe (x = 0, 0.002, 0.004, 0.006, 0.008, 0.010 wt%) on the melting point, microstructure, spreadability, and mechanical properties of the Sn–58Bi–5In–xGe solder were investigated. The experimental results showed that the addition of trace Ge had little effect on the melting point. Benefiting from the intrinsic anti-oxidant property of Ge, the addition of Ge could significantly improve the wettability and spreadability of the solder alloy. The microstructures of the solder were mainly composed of Bi, β-Sn matrix and BiIn phase. When Ge content was increased from 0 to 0.004%, the elongation of solder alloy was increased from 27.05 to 31.09%. And the fracture appearance of the tensile sample was changed from cleavage fracture to quasi-cleavage fracture. The trace Ge could effectively inhibit the coarsening of Bi-rich phases and promote their uniform dispersion, thereby synergistically enhancing the tensile strength and elongation of the solder. When the Ge addition content reached 0.04%, the tensile fracture mode of the alloy transitioned from brittle cleavage fracture to quasi-cleavage fracture.