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<p>Research on solder reliability primarily focuses on quinary and six-component lead-free solders, with limited attention given to seven-component solders and the inclusion of Ti elements. This study incorporated Ti alloy elements into Sn-3.0Ag-0.5Cu-Bi-Sb-Ni solder to prepare SAC305-3Bi-2Sb-0.1Ni-<i>x</i>Ti (<i>x</i> = 0, 0.1, 0.2, 0.3 wt%) composite solders. The microstructure, in-situ thermal aging behavior, formation of intermetallic compounds (IMC) at the interface, mechanical properties of the solder joints, and element diffusion differences were systematically studied. The results indicated that Ti addition refined the microstructure of the solder alloy. When the Ti content reached 0.2 wt%, the Vickers hardness of the solder alloy peaked at 22.84 HV, and the maximum tensile strength of the solder joint was 79.98 MPa, demonstrating excellent mechanical properties. After aging at 150 ℃, the IMC growth factor at the solder joint interface was minimized to 0.1747 μm<sup>2</sup>/h. During the in-situ high-temperature aging experiment, the growth factor was reduced, and Ti effectively suppressed the growth of IMCs in the solder matrix. The experimental results indicate that Ti addition enhanced the reliability of the solder joints, with the greatest improvement observed at a Ti content of 0.2 wt%.</p>

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Effect of Ti content on the microstructure evolution and solder joint reliability of SAC305-2.0Sb-3.0Bi-0.1Ni lead-free solder alloy

  • 期刊论文

  • 发表日期：

    2026年2月26日

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  • Jiangshan Liu,
  • Jiayi Xu,
  • Senlin Yi,
  • Xiu Li,
  • Hongyang Tan,
  • Biao Wang,
  • Jikang Yan

摘要

Research on solder reliability primarily focuses on quinary and six-component lead-free solders, with limited attention given to seven-component solders and the inclusion of Ti elements. This study incorporated Ti alloy elements into Sn-3.0Ag-0.5Cu-Bi-Sb-Ni solder to prepare SAC305-3Bi-2Sb-0.1Ni-xTi (x = 0, 0.1, 0.2, 0.3 wt%) composite solders. The microstructure, in-situ thermal aging behavior, formation of intermetallic compounds (IMC) at the interface, mechanical properties of the solder joints, and element diffusion differences were systematically studied. The results indicated that Ti addition refined the microstructure of the solder alloy. When the Ti content reached 0.2 wt%, the Vickers hardness of the solder alloy peaked at 22.84 HV, and the maximum tensile strength of the solder joint was 79.98 MPa, demonstrating excellent mechanical properties. After aging at 150 ℃, the IMC growth factor at the solder joint interface was minimized to 0.1747 μm2/h. During the in-situ high-temperature aging experiment, the growth factor was reduced, and Ti effectively suppressed the growth of IMCs in the solder matrix. The experimental results indicate that Ti addition enhanced the reliability of the solder joints, with the greatest improvement observed at a Ti content of 0.2 wt%.