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<p>This study systematically evaluated the microstructure, melting behavior, tensile performance, wettability, interfacial reactions, and electrochemical corrosion resistance of low-temperature lead-free Sn-58Bi-xAg solder alloys. The results show that the alloys are primarily composed of Sn-rich phases, Bi-rich phases, and Ag<sub>3</sub>Sn intermetallic compounds. As the Ag content increases, Ag<sub>3</sub>Sn coarsens from finely dispersed particles into blocky structures, accompanied by evolution of the eutectic morphology. Differential scanning calorimetry indicates that the addition of 0.5% Ag narrows the melting range from 13.3℃ to 11.7℃. Compared with Sn-58Bi, Sn-58Bi-0.5Ag exhibits an increase in tensile strength from 59.8&#xa0;MPa to 62.0&#xa0;MPa, a reduction in contact angle on Cu substrates from 58° to 50°, and the lowest corrosion current density (6.8164 × 10<sup>–6</sup> A·cm<sup>−2</sup>) in 3.5% NaCl solution. At 1% Ag content, the alloy achieves the highest tensile strength (74.0&#xa0;MPa) and the smallest contact angle (45°), whereas 2% Ag leads to microstructural coarsening and property degradation. Comprehensive analysis demonstrates that Sn-58Bi-0.5Ag offers the best balance of overall properties, showing promising potential for low-temperature electronic packaging applications.</p>

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Microstructural evolution and comprehensive property evaluation of Sn-Bi-Ag lead-free solder alloys

  • 期刊论文

  • 发表日期：

    2026年2月12日

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  • Jun Sheng,
  • Bowen Liu,
  • Ya Liu,
  • Zhiqiu Guo,
  • Changjun Wu,
  • Junxiu Chen,
  • Xuping Su

摘要

This study systematically evaluated the microstructure, melting behavior, tensile performance, wettability, interfacial reactions, and electrochemical corrosion resistance of low-temperature lead-free Sn-58Bi-xAg solder alloys. The results show that the alloys are primarily composed of Sn-rich phases, Bi-rich phases, and Ag3Sn intermetallic compounds. As the Ag content increases, Ag3Sn coarsens from finely dispersed particles into blocky structures, accompanied by evolution of the eutectic morphology. Differential scanning calorimetry indicates that the addition of 0.5% Ag narrows the melting range from 13.3℃ to 11.7℃. Compared with Sn-58Bi, Sn-58Bi-0.5Ag exhibits an increase in tensile strength from 59.8 MPa to 62.0 MPa, a reduction in contact angle on Cu substrates from 58° to 50°, and the lowest corrosion current density (6.8164 × 10–6 A·cm−2) in 3.5% NaCl solution. At 1% Ag content, the alloy achieves the highest tensile strength (74.0 MPa) and the smallest contact angle (45°), whereas 2% Ag leads to microstructural coarsening and property degradation. Comprehensive analysis demonstrates that Sn-58Bi-0.5Ag offers the best balance of overall properties, showing promising potential for low-temperature electronic packaging applications.