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<p>In this study, the shear strength and corrosion resistance of Cu/Sn–3.0Ag–0.5Cu–<i>x</i>TiO<sub>2</sub>/Cu solder joints were systematically investigated to determine the mechanism by which various mass fractions of TiO<sub>2</sub> nanoparticle doping affect them. The experiment was designed with four sets of TiO<sub>2</sub> doping concentrations (<i>x</i> = 0, 0.3, 0.6, 0.9&#xa0;wt%). The corrosion and mechanical properties of the soldered joints were characterized at various periods of corrosion. The joints were subjected to immersion corrosion testing in a 3.5&#xa0;wt% NaCl solution for a maximum of 28&#xa0;days. The experimental results indicate that the corrosion resistance of the soldered joints firstly increases and then decreases as the TiO<sub>2</sub> doping content increases. Under uncorroded conditions, the shear strength shows a monotonically increasing pattern. The shear strength of the solder joints containing 0.9&#xa0;wt% TiO<sub>2</sub> decreased significantly more than that of the other groups after 28&#xa0;days of corrosion. Based on first-principles calculations, the corrosion resistance of the solder joints can be enhanced by the formation of stable TiO<sub>2</sub>–Sn interface chemical bonds, which have a binding energy of 2.04&#xa0;eV, within the Sn matrix through the incorporation of TiO<sub>2</sub> nanoparticles. However, the agglomeration effect of TiO<sub>2</sub> nanoparticles results in a substantial decrease in the effective bonding area between the Sn substrate and TiO<sub>2</sub> nanoparticles when the doping concentration surpasses the critical threshold. Consequently, the corrosion protection performance is substantially diminished.</p>

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Effects of TiO2 nanoparticles on mechanical and corrosion properties of Cu/SAC305–xTiO2/Cu solder joints: experiments and theoretical calculations

  • 期刊论文

  • 发表日期：

    2026年1月16日

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  • Rugao Huang,
  • Langfeng Zhu,
  • Xiaowu Hu,
  • Jinghui Fan,
  • Zhixiang Wu,
  • Wenjing Chen

摘要

In this study, the shear strength and corrosion resistance of Cu/Sn–3.0Ag–0.5Cu–xTiO2/Cu solder joints were systematically investigated to determine the mechanism by which various mass fractions of TiO2 nanoparticle doping affect them. The experiment was designed with four sets of TiO2 doping concentrations (x = 0, 0.3, 0.6, 0.9 wt%). The corrosion and mechanical properties of the soldered joints were characterized at various periods of corrosion. The joints were subjected to immersion corrosion testing in a 3.5 wt% NaCl solution for a maximum of 28 days. The experimental results indicate that the corrosion resistance of the soldered joints firstly increases and then decreases as the TiO2 doping content increases. Under uncorroded conditions, the shear strength shows a monotonically increasing pattern. The shear strength of the solder joints containing 0.9 wt% TiO2 decreased significantly more than that of the other groups after 28 days of corrosion. Based on first-principles calculations, the corrosion resistance of the solder joints can be enhanced by the formation of stable TiO2–Sn interface chemical bonds, which have a binding energy of 2.04 eV, within the Sn matrix through the incorporation of TiO2 nanoparticles. However, the agglomeration effect of TiO2 nanoparticles results in a substantial decrease in the effective bonding area between the Sn substrate and TiO2 nanoparticles when the doping concentration surpasses the critical threshold. Consequently, the corrosion protection performance is substantially diminished.