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<p>With electronic devices advancing toward miniaturization, high integration, and high performance, heat flux density per unit area has surged dramatically—a trend that directly exacerbates the risk of device overheating and performance degradation. This reality has left traditional thermal conductive pastes struggling to meet modern heat dissipation demands. For thermal conductive materials, precise regulation of filler orientation to form efficient thermal pathways remains a longstanding challenge, as current methods often fail to balance effectiveness with practicality for paste systems. This study addresses this gap by developing a novel strategy: filling copper (Cu) into halloysite nanotubes (HNTs) via multi-cycle negative-pressure filling; excess Cu dispersed externally, forming a "point-line" structure. Compounding this Cu-HNTs powder with silicone oil yielded a thermal paste with a "point-line-plane" thermal system—a hierarchical design that leverages the strengths of each component: HNTs provide linear pathways, Cu points bridge gaps, and silicone oil enables planar heat spread. Experimental results show that the powder after three fillings has a thermal conductivity of 0.2236 W/(m·K); the paste reached 0.55574 W/(m·K) after compounding with silicone oil. Applying 500&#xa0;V for 5&#xa0;h further raised it to 0.66 W/(m·K)—over 8 times that of pristine HNTs. This low-cost, low-equipment approach solves paste filler orientation issues, suits electronic device heat dissipation (e.g., LED tubes, computer components), and offers a practical, scalable design paradigm that bridges lab-scale innovation to industrial thermal management needs—a critical step forward for next generation electronics.</p>

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Electric field aligned Cu filled halloysite nanotubes: eightfold enhanced thermal conductive paste for electronic device thermal management

  • 期刊论文

  • 发表日期：

    2025年12月27日

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  • Liuyang Wang,
  • Huijun Zhang,
  • Bo Zhao,
  • Haiwei Yang,
  • Hailei Zhang,
  • Yonggang Wu,
  • Hongchi Zhao,
  • Libin Bai

摘要

With electronic devices advancing toward miniaturization, high integration, and high performance, heat flux density per unit area has surged dramatically—a trend that directly exacerbates the risk of device overheating and performance degradation. This reality has left traditional thermal conductive pastes struggling to meet modern heat dissipation demands. For thermal conductive materials, precise regulation of filler orientation to form efficient thermal pathways remains a longstanding challenge, as current methods often fail to balance effectiveness with practicality for paste systems. This study addresses this gap by developing a novel strategy: filling copper (Cu) into halloysite nanotubes (HNTs) via multi-cycle negative-pressure filling; excess Cu dispersed externally, forming a "point-line" structure. Compounding this Cu-HNTs powder with silicone oil yielded a thermal paste with a "point-line-plane" thermal system—a hierarchical design that leverages the strengths of each component: HNTs provide linear pathways, Cu points bridge gaps, and silicone oil enables planar heat spread. Experimental results show that the powder after three fillings has a thermal conductivity of 0.2236 W/(m·K); the paste reached 0.55574 W/(m·K) after compounding with silicone oil. Applying 500 V for 5 h further raised it to 0.66 W/(m·K)—over 8 times that of pristine HNTs. This low-cost, low-equipment approach solves paste filler orientation issues, suits electronic device heat dissipation (e.g., LED tubes, computer components), and offers a practical, scalable design paradigm that bridges lab-scale innovation to industrial thermal management needs—a critical step forward for next generation electronics.