<p>Amorphous FeSiPC soft magnetic composites (SMCs) with high compacted density and excellent magnetic properties were successfully hot-compacted at a low pressure of 400&#xa0;MPa. Hot pressing enhances the compaction density and reduces the non-magnetic pore fraction in SMCs, which lowers the resistance to domain wall motion during magnetization, thereby improving the soft magnetic properties. Under optimal conditions, with a compaction temperature of 420&#xa0;°C, the compaction density of FeSiPC SMCs increased by 24% to 6.32&#xa0;g/cm<sup>3</sup>, the effective permeability increased by 4.15 times to 81, and the total core loss decreased by 33% to 321&#xa0;kW/m<sup>3</sup> at 100&#xa0;kHz and 0.05&#xa0;T, compared to cold-pressed samples. These results highlight that low-pressure hot compaction is an effective method for enhancing the soft magnetic properties of amorphous SMCs, making them suitable for the evolving demands of high-frequency and miniaturized electronic devices.</p>

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Magnetic properties of soft magnetic composites fabricated from FeSiPC amorphous powder by hot pressing molding

  • Yan Ma,
  • Lei Xie,
  • Xiantao Sun,
  • Chaolin Zhang,
  • Qiang Li,
  • Qiang Chi,
  • Guan Zhang

摘要

Amorphous FeSiPC soft magnetic composites (SMCs) with high compacted density and excellent magnetic properties were successfully hot-compacted at a low pressure of 400 MPa. Hot pressing enhances the compaction density and reduces the non-magnetic pore fraction in SMCs, which lowers the resistance to domain wall motion during magnetization, thereby improving the soft magnetic properties. Under optimal conditions, with a compaction temperature of 420 °C, the compaction density of FeSiPC SMCs increased by 24% to 6.32 g/cm3, the effective permeability increased by 4.15 times to 81, and the total core loss decreased by 33% to 321 kW/m3 at 100 kHz and 0.05 T, compared to cold-pressed samples. These results highlight that low-pressure hot compaction is an effective method for enhancing the soft magnetic properties of amorphous SMCs, making them suitable for the evolving demands of high-frequency and miniaturized electronic devices.