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<p>This study systematically investigates the impact of lanthanum (La) addition (0.5–1.0 wt.%) and manufacturing methods on Sn-7Zn-5Sb lead-free solder alloys, representing the first comprehensive analysis of Sb-La synergistic effects in this system. Two alloy compositions (Sn-7Zn-5Sb-0.5La and Sn-7.5Zn-4.5Sb-1.0La) were prepared via&#xa0;precisely controlled furnace melting (700&#xa0;°C for 45&#xa0;min)&#xa0;and ball milling&#xa0;300&#xa0;rpm for 25–35&#xa0;h), followed by characterization of microstructure, mechanical, electrical, and thermal properties. Key findings reveal the following: While La enhanced properties, 0.5 wt.% addition increased tensile strength by 11.3% compared to 1 wt.% in furnace-melted samples (from 40.48 to 45.06&#xa0;MPa), its optimal content was 0.5 wt.%, with excessive La (1 wt.%) causing particle aggregation and 18.7% lower electrical conductivity (3.67 vs. 11.11 IACS).&#xa0;Ball milling for 30&#xa0;h with 1 wt.% La produced exceptional tensile strength (69.25&#xa0;MPa, 54% higher than furnace-melted counterparts), demonstrating the method’s advantage for mechanical performance. Microstructural analysis showed La’s grain refining effect, reducing average grain size by 38% at 0.5 wt.% compared to 1 wt.% additions. Differential scanning calorimetry revealed that La content significantly impacts thermal behavior, with 0.5 wt.% La showing a sharper melting transition (1.201 vs. 1.304 Mw/mg peak area for 1 wt.%) at 208.3&#xa0;°C.&#xa0;These findings provide critical insights for developing high-performance lead-free solders through controlled rare earth additions and processing optimization.</p>

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Impact of La addition and processing methods on the microstructure, mechanical, and electrical properties of the Sn–Zn–Sb lead-free solders

  • 期刊论文

  • 发表日期：

    2025年9月22日

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  • D Arthur Jebastine Sunderraj,
  • D Ananthapadmanaban,
  • Arun Vasantha Geethan Kathiresan

摘要

This study systematically investigates the impact of lanthanum (La) addition (0.5–1.0 wt.%) and manufacturing methods on Sn-7Zn-5Sb lead-free solder alloys, representing the first comprehensive analysis of Sb-La synergistic effects in this system. Two alloy compositions (Sn-7Zn-5Sb-0.5La and Sn-7.5Zn-4.5Sb-1.0La) were prepared via precisely controlled furnace melting (700 °C for 45 min) and ball milling 300 rpm for 25–35 h), followed by characterization of microstructure, mechanical, electrical, and thermal properties. Key findings reveal the following: While La enhanced properties, 0.5 wt.% addition increased tensile strength by 11.3% compared to 1 wt.% in furnace-melted samples (from 40.48 to 45.06 MPa), its optimal content was 0.5 wt.%, with excessive La (1 wt.%) causing particle aggregation and 18.7% lower electrical conductivity (3.67 vs. 11.11 IACS). Ball milling for 30 h with 1 wt.% La produced exceptional tensile strength (69.25 MPa, 54% higher than furnace-melted counterparts), demonstrating the method’s advantage for mechanical performance. Microstructural analysis showed La’s grain refining effect, reducing average grain size by 38% at 0.5 wt.% compared to 1 wt.% additions. Differential scanning calorimetry revealed that La content significantly impacts thermal behavior, with 0.5 wt.% La showing a sharper melting transition (1.201 vs. 1.304 Mw/mg peak area for 1 wt.%) at 208.3 °C. These findings provide critical insights for developing high-performance lead-free solders through controlled rare earth additions and processing optimization.