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<p>This study investigates the effects of minor silver (Ag) additions (1–3wt %) on the microstructure, reaction temperatures, and phase composition of an In-35Sn alloy, aiming to understand improved low-temperature solders for advanced electronic packaging. Samples were characterised using field emission scanning electron microscopy (FESEM), differential scanning calorimetry (DSC), synchrotron X-ray diffraction (synchrotron XRD) and synchrotron imaging X-ray fluorescence (µ-XRF). For chemical analysis, synchrotron soft X-ray photoelectron spectroscopy (XPS) was performed. Microstructure observations showed that the formation of AgIn<sub>2</sub> fine particles and finer γ-InSn<sub>4</sub> was obvious at higher concentrations of Ag. Synchrotron XRD at 25 and 115&#xa0;°C showed the presence of β-In<sub>3</sub>Sn, γ-InSn<sub>4</sub> and AgIn<sub>2</sub> phases in ISA3510 alloy, indicating a preference for Ag to segregate and form intermetallic at In sites rather than Sn sites. Calculated average crystallite size of γ-InSn<sub>4</sub> decreased approximately 25% with 1wt% Ag added to the system. The split spin orbitals of In3d and Sn3d of the alloy indicated the materialisation of In–Sn. Plasmon loss structure of In3d was found at approximately + 11.5 ± 0.1&#xa0;eV from the main peak. Additionally, the thermal analysis revealed a decrease in melting and cooling onset temperatures, along with changes in pasty range and undercooling behaviour. The addition of Ag showed approximately 40% improvement of microhardness in In-35Sn-3Ag. The findings provide insights into the complex correlation between phase composition, microstructure, thermal properties and microhardness in In–Sn–Ag alloys. These results can guide the development of improved low-temperature solders with enhanced performance for next-generation electronic packaging applications.</p>

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Role of Ag additions on microstructure, phase transformation and thermal reactions of In-35Sn alloys

  • 期刊论文

  • 出版模式：

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  • 发表日期：

    2025年9月9日

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  • Y. P. Tan,
  • M. A. A. Mohd Salleh,
  • Z. Sauli,
  • F. Somidin,
  • K. Kamonsuangkasem,
  • S. Tancharakorn,
  • W. Tantanuch,
  • H. Nakajima,
  • K. Nogita

摘要

This study investigates the effects of minor silver (Ag) additions (1–3wt %) on the microstructure, reaction temperatures, and phase composition of an In-35Sn alloy, aiming to understand improved low-temperature solders for advanced electronic packaging. Samples were characterised using field emission scanning electron microscopy (FESEM), differential scanning calorimetry (DSC), synchrotron X-ray diffraction (synchrotron XRD) and synchrotron imaging X-ray fluorescence (µ-XRF). For chemical analysis, synchrotron soft X-ray photoelectron spectroscopy (XPS) was performed. Microstructure observations showed that the formation of AgIn2 fine particles and finer γ-InSn4 was obvious at higher concentrations of Ag. Synchrotron XRD at 25 and 115 °C showed the presence of β-In3Sn, γ-InSn4 and AgIn2 phases in ISA3510 alloy, indicating a preference for Ag to segregate and form intermetallic at In sites rather than Sn sites. Calculated average crystallite size of γ-InSn4 decreased approximately 25% with 1wt% Ag added to the system. The split spin orbitals of In3d and Sn3d of the alloy indicated the materialisation of In–Sn. Plasmon loss structure of In3d was found at approximately + 11.5 ± 0.1 eV from the main peak. Additionally, the thermal analysis revealed a decrease in melting and cooling onset temperatures, along with changes in pasty range and undercooling behaviour. The addition of Ag showed approximately 40% improvement of microhardness in In-35Sn-3Ag. The findings provide insights into the complex correlation between phase composition, microstructure, thermal properties and microhardness in In–Sn–Ag alloys. These results can guide the development of improved low-temperature solders with enhanced performance for next-generation electronic packaging applications.