Printable and flexible electronics for smart packaging applications: status, challenges, and opportunities
摘要
The demand for food safety and quality has revolutionized the production of flexible electronics. This technology helps track, monitor, and interact with food products. They represent a new era of innovation, offering advantages ranging from improved functionality to greater sustainability. This technology allows consumers to communicate with the food product by giving them real-time monitoring. The advancements in printing techniques onto the flexible substrate have helped in the development of sensors such as humidity, temperature, and pressure sensors. These sensors in the packaging material help maintain the traceability of the food product and determine spoilage in the food product. In this review paper, we have addressed the utilization of printable and flexible electronics for smart packaging applications. The different types of functional materials, such as inks and substrates, and different techniques are used to incorporate these materials into flexible electronics. Further, we have discussed the applications of printable electronics for smart food packaging. However, several challenges, such as cost-effectiveness, IoT communication, data security, and raising consumer awareness, have limited the usage of flexible electronics. Future developments in printed electronics are focused on creating thin-film-based electronics and developing bio-based conductive ink to improve sustainability.