<p>This study aims to develop an electroless silver plating bath based on silver methanesulfonate to achieve a uniform silver coating on the surface of copper powders that have been pretreated using a hydrothermal method. This electroless Ag plating bath stands out due to its nitrate- and ethylenediaminetetraacetic acid (EDTA)-free formulation, with methanesulfonate ions acting as a complexing agent to stabilize silver ions. A dense, highly conductive silver layer was successfully coated on the surface of the Cu powder after the electroless process. A conductive adhesive was prepared using silver-plated Cu powder as a conductive filler. The morphology, crystal structure and composition were characterized using scanning electron microscopy (SEM), X-ray diffraction (XRD), and energy dispersive spectroscopy (EDS). The results showed that the silver layer was continuous and uniform, with a surface silver content of 29.80 wt%. The four-probe resistance meter test results showed that the conductivity of the silver-plated Cu powder had increased substantially. The volume resistivity was measured at 6.17 × 10⁻⁵ Ω cm, increasing to 7.15 × 10⁻⁵ Ω cm following the aging test. The shear strength was measured to be 11.86&#xa0;MPa using a push–pull force test. Differential scanning calorimetry (DSC) and thermogravimetry (TG) analyses revealed minimal weight gain (0.211%) of the silver-plated Cu powder at 325&#xa0;°C. These results substantiate the efficacy of the silver layer in impeding the oxidation of the Cu powder. This study proposes a cost-effective method of producing high-performance silver-plated Cu powder, with potential applications in electronic packaging and conductive pastes.</p>