<p>Ternary copper-based Cu<sub>3</sub>SbSe<sub>4</sub> compound has emerged as a promising thermoelectric material. However, its practical application is limited by relatively low thermoelectric performance, primarily due to inferior electrical properties. In this work, the Cu<sub>3</sub>SbSe<sub>4</sub>-based composites with incorporated 2D MXenes (<i>i.e.</i>, Ti<sub>3</sub>C<sub>2</sub>T<sub>x</sub>) were synthesized by combining mechanical alloying with spark plasma sintering technique. The introduction of 2D Ti<sub>3</sub>C<sub>2</sub>T<sub>x</sub> nanosheets significantly enhanced the Seebeck coefficient, which is ascribed to the energy-dependent carrier scattering. Resultantly, an optimized <i>PF</i> ~ 1.1 mWm<sup>−1</sup>&#xa0;K<sup>−2</sup> can be realized in the bulk composite with <i>x</i> = 1.5. All composite samples exhibited low thermal conductivity in high temperature, attributed to enhanced interfacial phonon scattering. As a result, the best <i>ZT</i> value of 0.59 at 623&#xa0;K is obtained for the bulk Cu<sub>3</sub>Sb<sub>0.98</sub>Sn<sub>0.02</sub>Se<sub>4</sub>/1.5 vol % Ti<sub>3</sub>C<sub>2</sub>T<sub>x</sub> composite, which increases by 31% compared with that of the matrix. This study demonstrates that incorporation of 2D MXenes into ternary copper-based compounds is an effective strategy to enhance their TE performance.</p>

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Enhanced thermoelectric performance in Cu3SbSe4-based materials through incorporating 2D MXenes

  • Xiaona Mi,
  • Jian Xu,
  • Mingjie Yu,
  • Yiming Gao,
  • Dewei Zhang,
  • Qinfang Zhang

摘要

Ternary copper-based Cu3SbSe4 compound has emerged as a promising thermoelectric material. However, its practical application is limited by relatively low thermoelectric performance, primarily due to inferior electrical properties. In this work, the Cu3SbSe4-based composites with incorporated 2D MXenes (i.e., Ti3C2Tx) were synthesized by combining mechanical alloying with spark plasma sintering technique. The introduction of 2D Ti3C2Tx nanosheets significantly enhanced the Seebeck coefficient, which is ascribed to the energy-dependent carrier scattering. Resultantly, an optimized PF ~ 1.1 mWm−1 K−2 can be realized in the bulk composite with x = 1.5. All composite samples exhibited low thermal conductivity in high temperature, attributed to enhanced interfacial phonon scattering. As a result, the best ZT value of 0.59 at 623 K is obtained for the bulk Cu3Sb0.98Sn0.02Se4/1.5 vol % Ti3C2Tx composite, which increases by 31% compared with that of the matrix. This study demonstrates that incorporation of 2D MXenes into ternary copper-based compounds is an effective strategy to enhance their TE performance.