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<p>Sn58Bi solder is a commonly used material for chip interconnection due to its low melting point, good creep resistance, and reasonable price. In this study, the interfacial microstructure, mechanical properties, and wettability of Sn58Bi-<i>x</i>TiN (<i>x</i> = 0, 0.05, 0.1, 0.15, 0.2, 0.25; wt.%) solder joints were investigated using scanning electron microscopy, universal testing machine, and contact angle measuring instrument. The results demonstrated that the growth of the interfacial intermetallic compound (IMC) layer was effectively suppressed by adding trace amounts of TiN nanoparticles. When the added TiN nanoparticles was 0.15 wt.%, the interface layer of Sn58Bi solder joints was reduced from the initial 0.66&#xa0;μm to 0.57&#xa0;μm. Shear test revealed that with the addition of 0.15 wt.% TiN nanoparticles, the shear strength of Sn58Bi solder joints reached a maximum of 46.1&#xa0;MPa. In addition, the wetting angle of Sn58Bi-0.15TiN solder joints was reduced from 17.1° to 10.4°.</p>

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Nanoparticle-modified SnBi solder: a comprehensive study on interfacial microstructure, shear strength, and wettability

  • 期刊论文

  • 发表日期：

    2025年7月29日

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  • Lei Sun,
  • Xuanyu Chen,
  • Peng He,
  • Shuye Zhang,
  • Minghe Chen

摘要

Sn58Bi solder is a commonly used material for chip interconnection due to its low melting point, good creep resistance, and reasonable price. In this study, the interfacial microstructure, mechanical properties, and wettability of Sn58Bi-xTiN (x = 0, 0.05, 0.1, 0.15, 0.2, 0.25; wt.%) solder joints were investigated using scanning electron microscopy, universal testing machine, and contact angle measuring instrument. The results demonstrated that the growth of the interfacial intermetallic compound (IMC) layer was effectively suppressed by adding trace amounts of TiN nanoparticles. When the added TiN nanoparticles was 0.15 wt.%, the interface layer of Sn58Bi solder joints was reduced from the initial 0.66 μm to 0.57 μm. Shear test revealed that with the addition of 0.15 wt.% TiN nanoparticles, the shear strength of Sn58Bi solder joints reached a maximum of 46.1 MPa. In addition, the wetting angle of Sn58Bi-0.15TiN solder joints was reduced from 17.1° to 10.4°.