Scholarlink

<p>Laser soldering offers localized heating and shorter processing times, reducing thermal damage and improving Mini-LED bonding reliability over reflow soldering in microelectromechanical systems packages. This study examines the microstructural, mechanical, and aging properties of Mini-LED joints formed using Type-8 (2–8&#xa0;µm) Sn–3.0Ag–0.5Cu solder paste in a Laser-Assisted Bonding process. Effective bonding was achieved at laser beam power 47–57 W, with Cu<sub>6</sub>Sn<sub>5</sub> intermetallic compound (IMC) thickness increasing from 2.2 ± 0.58&#xa0;μm at 47 W to 2.6 ± 0.3&#xa0;μm at 57 W. Isothermal aging at 125&#xa0;°C further increased IMC thickness to 4.8 ± 0.15&#xa0;μm after 400&#xa0;h for 57 W soldered joints, alongside microstructural coarsening. Joints soldered at 52 W showed the highest initial shear strength (0.9 ± 0.5 N), but aging altered fracture modes, with coarsened Ag<sub>3</sub>Sn and thicker Cu<sub>6</sub>Sn<sub>5</sub> IMCs causing brittle failures at higher power levels. These results highlight the need to optimize laser beam power for balanced mechanical reliability and thermal stability in Mini-LED packaging.</p>

错误：搜索内容不能为空，请输入英文关键词
错误：关键词超出字数限制，请精简
高级检索

Effect of laser beam power on microstructure evolution and interface kinetics of laser-soldered mini-LEDs for MEMS packaging

  • 期刊论文

  • 发表日期：

    2025年8月7日

查看全文
  • Jun Ho Ku,
  • Sri Harini Rajendran,
  • Ashutosh Sharma,
  • Jae Pil Jung,
  • Hyun-Sik Kim

摘要

Laser soldering offers localized heating and shorter processing times, reducing thermal damage and improving Mini-LED bonding reliability over reflow soldering in microelectromechanical systems packages. This study examines the microstructural, mechanical, and aging properties of Mini-LED joints formed using Type-8 (2–8 µm) Sn–3.0Ag–0.5Cu solder paste in a Laser-Assisted Bonding process. Effective bonding was achieved at laser beam power 47–57 W, with Cu6Sn5 intermetallic compound (IMC) thickness increasing from 2.2 ± 0.58 μm at 47 W to 2.6 ± 0.3 μm at 57 W. Isothermal aging at 125 °C further increased IMC thickness to 4.8 ± 0.15 μm after 400 h for 57 W soldered joints, alongside microstructural coarsening. Joints soldered at 52 W showed the highest initial shear strength (0.9 ± 0.5 N), but aging altered fracture modes, with coarsened Ag3Sn and thicker Cu6Sn5 IMCs causing brittle failures at higher power levels. These results highlight the need to optimize laser beam power for balanced mechanical reliability and thermal stability in Mini-LED packaging.