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<p>With the development of integrated circuit packaging, the melting point and performance requirements of the packaging industry have gradually increased. Pb-16Sn-7.5Sb solder with a melting point of about 240&#xa0;°C is expected to become an ideal candidate solder at this temperature. Some studies have shown that the addition of Ag can improve the strength of soldering joints. In order to clarify the effect of adding Ag on the mechanical properties of the solder, We prepared Pb-16Sn-7.5Sb-xAg solder under hot extrusion, and studied its mechanical properties and microstructure. The results showed that in addition to Pb, SbSn and β-Sn, the Ag<sub>3</sub>Sn phase also exists in the solder added with Ag. The addition of Ag reduces the elongation of the solder and increases the tensile strength of the alloy at low tensile rate, the maximum tensile strength can be increased by 6 Mpa when the tensile rate is 5 × 10<sup>–3</sup>&#xa0;s<sup>−1</sup>.This study can provide guidance for the processing and preparation of the solder.</p>

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Effect of Ag content on microstructure and properties of Pb-16Sn-7.5Sb solder

  • 期刊论文

  • 发表日期：

    2025年7月29日

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  • Xiaodi Zhang,
  • Fan Wang,
  • Richu Wang,
  • Chaoqun Peng,
  • Zhiyong Cai,
  • Xiang Peng,
  • Jian Peng

摘要

With the development of integrated circuit packaging, the melting point and performance requirements of the packaging industry have gradually increased. Pb-16Sn-7.5Sb solder with a melting point of about 240 °C is expected to become an ideal candidate solder at this temperature. Some studies have shown that the addition of Ag can improve the strength of soldering joints. In order to clarify the effect of adding Ag on the mechanical properties of the solder, We prepared Pb-16Sn-7.5Sb-xAg solder under hot extrusion, and studied its mechanical properties and microstructure. The results showed that in addition to Pb, SbSn and β-Sn, the Ag3Sn phase also exists in the solder added with Ag. The addition of Ag reduces the elongation of the solder and increases the tensile strength of the alloy at low tensile rate, the maximum tensile strength can be increased by 6 Mpa when the tensile rate is 5 × 10–3 s−1.This study can provide guidance for the processing and preparation of the solder.