Preparation of high-performance tinned copper powder conductive adhesive
摘要
In this study, high-performance conductive adhesives were prepared from E-51 epoxy resin, triethanolamine, and copper powders mixed with flake and spherical particles treated by different methods, without the use of other coupling agents, dispersants, or reducing agents. The conductive adhesive was cured using a staged temperature increase, and the heat-cured copper powder-filled conductive adhesive exhibited a low volume resistivity (5.929 × 10–5 Ω·cm). This result was attributed to the enhanced oxidation resistance of the copper powder through the hydrothermal treatment, tin plating, and organic cladding. The coating of tin on copper powder resulted in the attainment of high electrical conductivity for the adhesive. Furthermore, the cross-linking structure of the E-51 epoxy resin ensured elevated levels of shear strength. The cost of these modified copper powder-filled conductive adhesives is likely to be lower than that of pure silver powder-filled conductive adhesives. Consequently, the tinned copper powder conductive adhesive may be employed in electronic packaging, thereby expanding the application prospects of conductive adhesives.