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<p>Literature reports indicate that existing synthesis methods for leveling agents often suffer from complex procedures, high environmental burden, challenging purification processes, and insufficient via filling efficiency. To address these limitations, a novel leveling agent (CDT) was synthesized using environmentally friendly materials through a simplified, cost-effective process that eliminates the need for post-synthesis purification. This study systematically investigates the influence of CDT on blind via filling performance in an acidic copper sulfate plating bath containing polyethylene glycol (PEG), bis(3-sulfopropyl) disulfide (SPS), and chloride ions. The chemical structure of CDT was characterized by Fourier-transform infrared spectroscopy (FTIR), nuclear magnetic resonance (NMR), and gel permeation chromatography (GPC). Quantum chemical calculations and molecular dynamics (MD) simulations revealed that CDT exhibits stronger adsorption on copper surfaces compared to conventional leveling agents. Electrochemical measurements confirmed its ability to suppress copper deposition and helped determine the optimal working concentration of CDT. Electroplating experiments further demonstrated CDT’s capability to achieve superfilling, indicating its suitability for printed circuit board (PCB) manufacturing. Scanning electron microscopy (SEM) results corroborated the validity of the optimal concentration established by electrochemical tests. Finally, X-ray photoelectron spectroscopy (XPS) confirmed strong interfacial interactions between CDT and the copper surface. These findings collectively suggest that CDT is a highly promising candidate for advanced leveling agent applications.</p>

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Exploration of poly(1,4-butanediol diglycidyl ether, 2-methylimidazole, and imidazole) as leveling agents in blind hole copper plating

  • 期刊论文

  • 发表日期：

    2025年6月23日

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  • Xiangjian Zeng,
  • Zhanchang Pan,
  • Guanghui Hu,
  • Guowei Xia,
  • Haiqing Huang,
  • Mingliang Zou,
  • Shikun Shi

摘要

Literature reports indicate that existing synthesis methods for leveling agents often suffer from complex procedures, high environmental burden, challenging purification processes, and insufficient via filling efficiency. To address these limitations, a novel leveling agent (CDT) was synthesized using environmentally friendly materials through a simplified, cost-effective process that eliminates the need for post-synthesis purification. This study systematically investigates the influence of CDT on blind via filling performance in an acidic copper sulfate plating bath containing polyethylene glycol (PEG), bis(3-sulfopropyl) disulfide (SPS), and chloride ions. The chemical structure of CDT was characterized by Fourier-transform infrared spectroscopy (FTIR), nuclear magnetic resonance (NMR), and gel permeation chromatography (GPC). Quantum chemical calculations and molecular dynamics (MD) simulations revealed that CDT exhibits stronger adsorption on copper surfaces compared to conventional leveling agents. Electrochemical measurements confirmed its ability to suppress copper deposition and helped determine the optimal working concentration of CDT. Electroplating experiments further demonstrated CDT’s capability to achieve superfilling, indicating its suitability for printed circuit board (PCB) manufacturing. Scanning electron microscopy (SEM) results corroborated the validity of the optimal concentration established by electrochemical tests. Finally, X-ray photoelectron spectroscopy (XPS) confirmed strong interfacial interactions between CDT and the copper surface. These findings collectively suggest that CDT is a highly promising candidate for advanced leveling agent applications.