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<p>In this study, interfacial reactions in the three types of lead-free solders (LFSs): Sn, Sn-3.0 wt&#xa0;%Ag-0.5 wt&#xa0;%Cu (SAC), and Sn-0.7 wt&#xa0;% Cu (SC) reacting with Cu-3.0 wt&#xa0;%Ni-0.65 wt&#xa0;%Si-0.15 wt&#xa0;%Mg alloy (C7025) were investigated. The liquid/solid reaction couple was used and LFS/C7025 couples were reacted at 240, 255, and 270&#xa0;°C for 0.5 to 20&#xa0;h. The scallop-shaped (Cu, Ni)<sub>6</sub>Sn<sub>5</sub> phase formed in all couples and its thickness increased with the longer reaction times and higher temperatures. The Cu<sub>3</sub>Sn phase formed at higher temperatures and longer reaction times. The Cu<sub>3</sub>Sn phase appeared in the Sn/C7025 couples reacted at 240 and 255&#xa0;°C after 10&#xa0;h, and at 270&#xa0;°C after 5&#xa0;h. The Cu<sub>3</sub>Sn phase was also formed in the SAC/C7025 and SC/C7025 couples at 270&#xa0;°C after 2&#xa0;h. The presence of Ni inhibited the growth of the Cu<sub>3</sub>Sn phase. The total IMC growth mechanism was diffusion-controlled in all LFS/C7025 couples. Ball shear tests showed that higher temperatures led to the coarsening of the (Cu, Ni)<sub>6</sub>Sn<sub>5</sub> phase and increased brittleness, which reduced shear strength.</p>

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Liquid/solid interfacial reactions between lead-free solders and Cu–Ni–Si–Mg alloy (C7025)

  • 期刊论文

  • 出版模式：

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  • 发表日期：

    2025年6月11日

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  • Ting Chen,
  • Yi-Chin Liou,
  • Hsien-Ming Hsiao,
  • Yee-Wen Yen

摘要

In this study, interfacial reactions in the three types of lead-free solders (LFSs): Sn, Sn-3.0 wt %Ag-0.5 wt %Cu (SAC), and Sn-0.7 wt % Cu (SC) reacting with Cu-3.0 wt %Ni-0.65 wt %Si-0.15 wt %Mg alloy (C7025) were investigated. The liquid/solid reaction couple was used and LFS/C7025 couples were reacted at 240, 255, and 270 °C for 0.5 to 20 h. The scallop-shaped (Cu, Ni)6Sn5 phase formed in all couples and its thickness increased with the longer reaction times and higher temperatures. The Cu3Sn phase formed at higher temperatures and longer reaction times. The Cu3Sn phase appeared in the Sn/C7025 couples reacted at 240 and 255 °C after 10 h, and at 270 °C after 5 h. The Cu3Sn phase was also formed in the SAC/C7025 and SC/C7025 couples at 270 °C after 2 h. The presence of Ni inhibited the growth of the Cu3Sn phase. The total IMC growth mechanism was diffusion-controlled in all LFS/C7025 couples. Ball shear tests showed that higher temperatures led to the coarsening of the (Cu, Ni)6Sn5 phase and increased brittleness, which reduced shear strength.