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<p>With the recent innovation of Open Artificial Intelligence (AI) and AI humanoid robot deployment, this increase has triggered the growth of graphic processing unit (GPU) and high bandwidth memory (HBM) for enabling the fastest AI integration in system level automation. It’s estimated that Robotics Market size is estimated at USD 100.59 billion in 2025, and is expected to reach USD 178.63 billion by 2030, at a CAGR of 12.17% during the forecast period (2025–2030) (Website, <a href="https://www.mordorintelligence.com/industry-reports/robotics-market?network=g&amp;source_campaign=&amp;utm_source=google&amp;utm_medium=cpc&amp;matchtype=p&amp;device=c&amp;gad_source=1&amp;gclid=CjwKCAjwzMi_BhACEiwAX4YZUKZ5jVsngrha_9-YcOMzXIx6F0E-npnwKMayMNiFjt09CsdqWpznHxoCjjUQAvD_BwE">https://www.mordorintelligence.com/industry-reports/robotics-market?network=g&amp;source_campaign=&amp;utm_source=google&amp;utm_medium=cpc&amp;matchtype=p&amp;device=c&amp;gad_source=1&amp;gclid=CjwKCAjwzMi_BhACEiwAX4YZUKZ5jVsngrha_9-YcOMzXIx6F0E-npnwKMayMNiFjt09CsdqWpznHxoCjjUQAvD_BwE</a>). One of the problems faced by AI humanoid deployment is the cooling of the overall systems and system level hardware reliability requirements. AI humanoid robots themselves consist of complicated sub-systems which being packed in a smaller yet higher mobility and short latency firmware. Hence, with recent callout for better thermal management as well as system reliability enhancement, it is crucial to innovate in electronic packaging materials to mitigate tremendous energy supply for enabling complicated AI humanoid robots. This paper discusses some of those key literatures of AI humanoid robots, future materials innovation for enabling effective thermal management of humanoid robots, hardware reliability requirements and possible reliability testing for qualification of materials used in AI humanoid robots.</p>

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Innovations needed, reliability issues, and technical challenges in the development of electronic materials for future AI humanoid robots: a critical assessment

  • 期刊论文

  • 发表日期：

    2025年6月13日

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  • C. L. Gan,
  • M. H. Chung,
  • Y. S. Zou

摘要

With the recent innovation of Open Artificial Intelligence (AI) and AI humanoid robot deployment, this increase has triggered the growth of graphic processing unit (GPU) and high bandwidth memory (HBM) for enabling the fastest AI integration in system level automation. It’s estimated that Robotics Market size is estimated at USD 100.59 billion in 2025, and is expected to reach USD 178.63 billion by 2030, at a CAGR of 12.17% during the forecast period (2025–2030) (Website, https://www.mordorintelligence.com/industry-reports/robotics-market?network=g&source_campaign=&utm_source=google&utm_medium=cpc&matchtype=p&device=c&gad_source=1&gclid=CjwKCAjwzMi_BhACEiwAX4YZUKZ5jVsngrha_9-YcOMzXIx6F0E-npnwKMayMNiFjt09CsdqWpznHxoCjjUQAvD_BwE). One of the problems faced by AI humanoid deployment is the cooling of the overall systems and system level hardware reliability requirements. AI humanoid robots themselves consist of complicated sub-systems which being packed in a smaller yet higher mobility and short latency firmware. Hence, with recent callout for better thermal management as well as system reliability enhancement, it is crucial to innovate in electronic packaging materials to mitigate tremendous energy supply for enabling complicated AI humanoid robots. This paper discusses some of those key literatures of AI humanoid robots, future materials innovation for enabling effective thermal management of humanoid robots, hardware reliability requirements and possible reliability testing for qualification of materials used in AI humanoid robots.