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<p>Poly (m-phenylene isophthalamide) (PMIA) is a high-performance polymer known for its exceptional thermal stability, mechanical strength, and chemical resistance, making it an ideal candidate for advanced material applications. This study presents the synthesis, characterization, and analysis of poly (m-phenylene isophthalamide) (PMIA)/SiO<sub>2</sub> nanocomposites and porous PMIA films. PMIA/SiO<sub>2</sub> nanocomposites were prepared using in situ interfacial polycondensation, incorporating 3-, 5-, and 7-wt% SiO<sub>2</sub> nanoparticles. Nanocomposite films were fabricated through a controlled casting method, followed by etching SiO<sub>2</sub> particles with hydrofluoric acid to create porous PMIA films. Enhancement of the PMIA/SiO<sub>2</sub> nanocomposites exhibited improved inherent viscosity, indicating high molecular weight and efficient polymerization. Fourier Transform Infrared (FTIR) spectroscopy confirmed the successful integration of SiO<sub>2</sub> into the PMIA matrix. Scanning Electron Microscopy (SEM) revealed uniform pore distribution in the porous films, with pore size increasing with higher SiO<sub>2</sub> content. Thermogravimetric analysis (TGA) demonstrated enhanced thermal stability of PMIA/SiO<sub>2</sub> composites, with degradation temperatures increasing from 440&#xa0;°C for pure PMIA to 460&#xa0;°C for composites containing 7-wt% SiO<sub>2</sub>. Mechanical testing indicated that PMIA/SiO<sub>2</sub> composites with 5-wt% SiO<sub>2</sub> achieved optimal tensile strength (31.8 MPa) and elongation at break (30.1%), while higher SiO<sub>2</sub> content resulted in reduced mechanical performance due to particle agglomeration. The dielectric constants of these porous films remained consistently lower than those of their nonporous counterparts throughout the frequency range of 1 Hz to 1 MHz. This work highlights the potential of PMIA/SiO<sub>2</sub> nanocomposites and porous PMIA films for advanced applications requiring thermal and mechanical resilience, with tunable properties achieved through SiO<sub>2</sub> content variation.</p>

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In situ synthesis of PMIA/SiO2 nanocomposites and porous PMIA films via SiO2 etching: thermal, mechanical, and dielectric properties

  • 期刊论文

  • 发表日期：

    2025年6月9日

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  • M. Abdelaty,
  • Zhu Huanhuan,
  • Hassan A. Ewais,
  • Ahmed Morsy,
  • Zhao Yun,
  • Jiao Qingze

摘要

Poly (m-phenylene isophthalamide) (PMIA) is a high-performance polymer known for its exceptional thermal stability, mechanical strength, and chemical resistance, making it an ideal candidate for advanced material applications. This study presents the synthesis, characterization, and analysis of poly (m-phenylene isophthalamide) (PMIA)/SiO2 nanocomposites and porous PMIA films. PMIA/SiO2 nanocomposites were prepared using in situ interfacial polycondensation, incorporating 3-, 5-, and 7-wt% SiO2 nanoparticles. Nanocomposite films were fabricated through a controlled casting method, followed by etching SiO2 particles with hydrofluoric acid to create porous PMIA films. Enhancement of the PMIA/SiO2 nanocomposites exhibited improved inherent viscosity, indicating high molecular weight and efficient polymerization. Fourier Transform Infrared (FTIR) spectroscopy confirmed the successful integration of SiO2 into the PMIA matrix. Scanning Electron Microscopy (SEM) revealed uniform pore distribution in the porous films, with pore size increasing with higher SiO2 content. Thermogravimetric analysis (TGA) demonstrated enhanced thermal stability of PMIA/SiO2 composites, with degradation temperatures increasing from 440 °C for pure PMIA to 460 °C for composites containing 7-wt% SiO2. Mechanical testing indicated that PMIA/SiO2 composites with 5-wt% SiO2 achieved optimal tensile strength (31.8 MPa) and elongation at break (30.1%), while higher SiO2 content resulted in reduced mechanical performance due to particle agglomeration. The dielectric constants of these porous films remained consistently lower than those of their nonporous counterparts throughout the frequency range of 1 Hz to 1 MHz. This work highlights the potential of PMIA/SiO2 nanocomposites and porous PMIA films for advanced applications requiring thermal and mechanical resilience, with tunable properties achieved through SiO2 content variation.