<p>Reducing the dielectric constant (<i>ε</i><sub>r</sub>) of inorganic dielectrics is both a requirement and a challenge for the development of high-frequency and high-speed electronics. Although introducing the air phase (<i>ε</i><sub>r</sub>&#xa0;≈&#xa0;1) effectively lowers <i>ε</i><sub>r</sub>, conventional pore-forming fabrication methods that introduce open pores will reduce the mechanical strength and increase the interfacial polarization loss. This study introduces a prefabricated template method using hollow microspheres to prepare closed-pore porous ceramics. Through controlled heat treatment, this approach enhances interfacial bonding to improve mechanical strength while preserving closed-pore integrity. The developed materials exhibit high flexural strength (9.9&#xa0;MPa) and better dielectric properties (dielectric constant 1.86, dielectric loss 0.0015 at 30&#xa0;GHz), making them ideal for high-frequency and high-speed applications. Superior performance (<i>S</i><sub>11</sub>&#xa0;=&#xa0;−&#xa0;62.62&#xa0;dB, gain&#xa0;=&#xa0;7.49&#xa0;dBi at 21–24&#xa0;GHz) were demonstrated by an antenna fabricated on this dielectric substrate, confirming its suitability for high-frequency signal transmission.</p>

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Ultralow dielectric constant porous ceramics in high-speed and high-frequency antenna applications

  • Zhang-Wei Wu,
  • Yu-Qin Wang,
  • Qiang-Zhi Li,
  • Jing Zhou,
  • Min-Hao Zhao,
  • Zi-Yu Pang,
  • Guan-Long Huang,
  • Jie Shen,
  • Wen Chen

摘要

Reducing the dielectric constant (εr) of inorganic dielectrics is both a requirement and a challenge for the development of high-frequency and high-speed electronics. Although introducing the air phase (εr ≈ 1) effectively lowers εr, conventional pore-forming fabrication methods that introduce open pores will reduce the mechanical strength and increase the interfacial polarization loss. This study introduces a prefabricated template method using hollow microspheres to prepare closed-pore porous ceramics. Through controlled heat treatment, this approach enhances interfacial bonding to improve mechanical strength while preserving closed-pore integrity. The developed materials exhibit high flexural strength (9.9 MPa) and better dielectric properties (dielectric constant 1.86, dielectric loss 0.0015 at 30 GHz), making them ideal for high-frequency and high-speed applications. Superior performance (S11 = − 62.62 dB, gain = 7.49 dBi at 21–24 GHz) were demonstrated by an antenna fabricated on this dielectric substrate, confirming its suitability for high-frequency signal transmission.