Effective surface passivation on n-type crystalline silicon of AlOx thin films by thermal atomic layer deposition
摘要
AlOx films usually present efficient surface passivation on p-type crystalline silicon (c-Si) wafers. Here, AlOx nanofilms were deposited by thermal atomic layer deposition (ALD) to explore the passivation potential on n-type c-Si wafers. By adjusting ALD conditions, different surface passivation performance was obtained. To understand this, the passivation mechanisms were analyzed according to the combination of chemical passivation and field-effect passivation. The results indicated that AlOx thin films with lower surface roughness, higher uniformity, higher fixed charge density at the AlOx/c-Si interface, and lower interface state density could exhibit remarkable passivation performance on n-type c-Si wafers. As a demonstration, a high effective minority carrier lifetime of 5 ms was obtained on the n-type c-Si wafer by 10 nm-thick AlOx film.