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<p>This study investigated the effects of Cr content on the microstructural, mechanical, and electrochemical properties of Sn–58Bi–0.075GNSs–<i>x</i>Cr composite solder. Microstructural analysis revealed that Cr addition significantly refined the grain size of the solder, with the most uniform microstructure observed at 0.2 wt% Cr. Hardness and tensile strength of the composite solders initially increased with Cr content, reaching a maximum at 0.2 wt% Cr, before decreasing. Electrochemical impedance spectroscopy and potentiodynamic polarization tests demonstrated that Cr doping enhanced the corrosion resistance of the composite solders, with the best corrosion resistance observed for the Sn–58Bi–0.075GNSs–0.3Cr composite. The fracture mode of the composite solders shifted from brittle to ductile with increasing Cr content. The addition of Cr also effectively suppressed the growth of the Cu6Sn5 intermetallic compound layer at the solder/Cu interface.</p>

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Effect of Cr addition on microstructure, mechanical properties and corrosion properties of Sn–58Bi–0.075GNSs solder alloy

  • 期刊论文

  • 发表日期：

    2025年6月28日

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  • Zhiyuan Liu,
  • Xin Zheng,
  • Chao Zhou,
  • Dongliang Ma

摘要

This study investigated the effects of Cr content on the microstructural, mechanical, and electrochemical properties of Sn–58Bi–0.075GNSs–xCr composite solder. Microstructural analysis revealed that Cr addition significantly refined the grain size of the solder, with the most uniform microstructure observed at 0.2 wt% Cr. Hardness and tensile strength of the composite solders initially increased with Cr content, reaching a maximum at 0.2 wt% Cr, before decreasing. Electrochemical impedance spectroscopy and potentiodynamic polarization tests demonstrated that Cr doping enhanced the corrosion resistance of the composite solders, with the best corrosion resistance observed for the Sn–58Bi–0.075GNSs–0.3Cr composite. The fracture mode of the composite solders shifted from brittle to ductile with increasing Cr content. The addition of Cr also effectively suppressed the growth of the Cu6Sn5 intermetallic compound layer at the solder/Cu interface.