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<p>The effects of Indium (In) content on interfacial reaction and microstructure evolution of Cu/Sn-3.0Ag-0.5Cu-<i>x</i>In/ENEPIG (SAC-<i>x</i>In, <i>x</i> = 0, 1, 2, 5 wt.%) ball grid array (BGA) solder joints were investigated. The growth of intermetallic compounds (IMCs) were suppressed by the solid dissolution of In into (Cu,Ni)<sub>6</sub>(Sn,In)<sub>5</sub>, which further inhibited the growth of Cu<sub>3</sub>Sn. The IMCs at the SAC/Cu interface exhibited the typical scallop-like morphology. As the In content increased, the IMCs became flatter while their grain size increased slightly. At the ENEPIG side, the IMCs changed from large rod-like to small needle-like shapes. Notably, the effects of In addition on the inhibition of the IMC growth and the microstructure refinement of the IMCs were most pronounced when the In content was 2 wt.%. While, the inhibition effect was weakened due to the formation of the Ag<sub>2</sub>In phase in the Cu/SAC-5In/ENEPIG BGA solder joints. Also, In addition promoted the dissolution of the Cu substrate and inhibited the dissolution of the ENEPIG substrate, which further affected the Cu-Ni cross-interaction in the Cu/SAC-<i>x</i>In/ENEPIG BGA solder joints. The growth, microstructure evolution and suppression mechanism of the interfacial IMCs in the Cu/SAC-<i>x</i>In/ENEPIG BGA solder joints were probed and discussed.</p>

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Effects of Indium content on interfacial reaction and microstructure evolution of Cu/SAC-xIn/ENEPIG BGA solder joints

  • 期刊论文

  • 发表日期：

    2025年5月12日

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  • Yiling Lin,
  • Ruisheng Xu,
  • Yuanyuan Qiao,
  • Ning Zhao

摘要

The effects of Indium (In) content on interfacial reaction and microstructure evolution of Cu/Sn-3.0Ag-0.5Cu-xIn/ENEPIG (SAC-xIn, x = 0, 1, 2, 5 wt.%) ball grid array (BGA) solder joints were investigated. The growth of intermetallic compounds (IMCs) were suppressed by the solid dissolution of In into (Cu,Ni)6(Sn,In)5, which further inhibited the growth of Cu3Sn. The IMCs at the SAC/Cu interface exhibited the typical scallop-like morphology. As the In content increased, the IMCs became flatter while their grain size increased slightly. At the ENEPIG side, the IMCs changed from large rod-like to small needle-like shapes. Notably, the effects of In addition on the inhibition of the IMC growth and the microstructure refinement of the IMCs were most pronounced when the In content was 2 wt.%. While, the inhibition effect was weakened due to the formation of the Ag2In phase in the Cu/SAC-5In/ENEPIG BGA solder joints. Also, In addition promoted the dissolution of the Cu substrate and inhibited the dissolution of the ENEPIG substrate, which further affected the Cu-Ni cross-interaction in the Cu/SAC-xIn/ENEPIG BGA solder joints. The growth, microstructure evolution and suppression mechanism of the interfacial IMCs in the Cu/SAC-xIn/ENEPIG BGA solder joints were probed and discussed.