High corrosion resistance and tensile strength in SAC305/Cu solder joint via super-rapid cooling
摘要
SAC305 alloy as a type of lead-free electronic material is expected to have high corrosion resistance and strength. In this study SAC305/Cu solder joints were prepared under three different cooling conditions. The corrosion behavior of the solder joint in 3.5wt% NaCl solution were investigated. The tensile strengths of solder joints before and after corrosion were tested. The results show that the Cu/SAC305/Cu solder joint prepared via rapid cooling always exhibited the most refined microstructure, the strongest corrosion resistance and the highest strength. The intermediate corrosion products were detected using energy dispersive spectrometer (EDS). After being corroded for 28 days, the strength of SAC305-W solder joint only decreased by 22.8%, while that of SAC305-F solder joint decreased by 56.2%. The difference in corrosion resistance is attributed to the influence of Ag3Sn on the corrosion current.