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<p>Surface oxidation and discoloration significantly impact soldering processes, particularly during high-temperature operations or extended air exposure, compromising joint performance, reliability, and esthetic quality. This study investigated Ga- and P-enhanced Sn–0.7Cu solder alloys, revealing a remarkable synergistic interaction between Ga (&gt; 120 ppm) and P (~ 40 ppm) that effectively minimized surface oxidation while maintaining cleanliness at above 400&#xa0;°C. Detailed analyses showed that Ga and P preferentially segregated to the oxidation surface, while nano-sized SnO<sub>2</sub> polycrystals formed adjacent to the single-crystal β-Sn matrix, notably without SnO phase formation. These modifications resulted in improved oxidation resistance and enhanced wetting characteristics, demonstrating the significant potential of Ga and P micro-alloying additions for developing advanced solder materials suited for electronic packaging and high-temperature applications.</p>

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High-temperature Ga–P-modified Sn–0.7Cu-based solder: oxidation resistance and solderability

  • 期刊论文

  • 发表日期：

    2025年2月2日

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  • Chen Liu,
  • Lingxue Guo,
  • Hongbo Lu,
  • Qin Wang,
  • Shanshan Cai,
  • Ruifeng Zhang,
  • Guang Zeng

摘要

Surface oxidation and discoloration significantly impact soldering processes, particularly during high-temperature operations or extended air exposure, compromising joint performance, reliability, and esthetic quality. This study investigated Ga- and P-enhanced Sn–0.7Cu solder alloys, revealing a remarkable synergistic interaction between Ga (> 120 ppm) and P (~ 40 ppm) that effectively minimized surface oxidation while maintaining cleanliness at above 400 °C. Detailed analyses showed that Ga and P preferentially segregated to the oxidation surface, while nano-sized SnO2 polycrystals formed adjacent to the single-crystal β-Sn matrix, notably without SnO phase formation. These modifications resulted in improved oxidation resistance and enhanced wetting characteristics, demonstrating the significant potential of Ga and P micro-alloying additions for developing advanced solder materials suited for electronic packaging and high-temperature applications.