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<p>The effect of 7K extreme low temperature storage on the electrical and mechanical properties of Sn–3.0%Ag–0.5%Cu(SAC305)/SnPb/electroless nickel immersion gold (ENIG) pads mixed solder joints was investigated. The resistance of the daisy chained solder joints was measured after RT and 7K storage, respectively. Ball shear test was conducted, and the morphography of the fracture surfaces was analyzed. Microstructure observations revealed that the composition of the intermetallic compound (IMC) layer next to the printed circuit boards (PCB) pads remained a combination of (Cu, Ni)<sub>6</sub>Sn<sub>5</sub> and (Ni, Cu)<sub>3</sub>Sn<sub>4</sub> after 7K storage. A very small amount of residual Pb rich phase owing to the degolding and plating process, even 1 wt%, could inhibit the evolution of IMCs as well as tin pest. This study could provide theoretical support for the application of SAC305/SnPb mixed solder joints under extreme low temperature, such as thermally uncontrolled electronics for deep space exploration.</p>

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Research on the effect of 7K extreme low temperature storage on the electrical and mechanical properties of SAC305/SnPb mixed solder joints

  • 期刊论文

  • 发表日期：

    2025年2月4日

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  • Lin Qi,
  • Weiling Xu,
  • Ben Fan,
  • Xingyu Pan,
  • Xingke Zhang,
  • Peipei Yu,
  • Yafei Zhao,
  • Xinchao Tan,
  • Xiaomei Tian,
  • Hailong Li

摘要

The effect of 7K extreme low temperature storage on the electrical and mechanical properties of Sn–3.0%Ag–0.5%Cu(SAC305)/SnPb/electroless nickel immersion gold (ENIG) pads mixed solder joints was investigated. The resistance of the daisy chained solder joints was measured after RT and 7K storage, respectively. Ball shear test was conducted, and the morphography of the fracture surfaces was analyzed. Microstructure observations revealed that the composition of the intermetallic compound (IMC) layer next to the printed circuit boards (PCB) pads remained a combination of (Cu, Ni)6Sn5 and (Ni, Cu)3Sn4 after 7K storage. A very small amount of residual Pb rich phase owing to the degolding and plating process, even 1 wt%, could inhibit the evolution of IMCs as well as tin pest. This study could provide theoretical support for the application of SAC305/SnPb mixed solder joints under extreme low temperature, such as thermally uncontrolled electronics for deep space exploration.