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<p>As micro-scale solder joints continue to shrink, the increasing intermetallic compound (IMC) fraction and high current density become critical factors affecting joint reliability. In this study, Cu/Sn/Cu joints with IMC fractions of 10%–50% were fabricated by varying bonding time (10&#xa0;min–30&#xa0;h), and tensile tests were conducted under current densities of 8 × 10<sup>3</sup>–1.8 × 10<sup>4</sup> A/cm<sup>2</sup> to investigate the coupled effects of microstructural evolution induced by IMC growth and current stressing on joint mechanical and fracture behavior. Under mechanical loading, increasing the IMC fraction improved tensile strength but promoted a ductile to brittle transition, with the critical IMC fraction experimentally identified within the range of 26.84–37.02%. Under electrical–mechanical coupled loading, current concentration overlapped with mechanically weak regions, accelerating damage initiation and failure in joints with high IMC fraction. Mechanistically, the thickened IMC layers formed during prolonged bonding impose stronger geometric constraint on the Sn matrix, decrease local stress triaxiality, and promote localized plastic flow. However, the inevitable formation of Kirkendall voids during IMC growth reduces the reliability of the joint. These results indicate that microstructural evolution induced by IMC growth changes the deformation mode from relatively uniform Sn matrix-dominated plasticity to IMC-constrained localized deformation, thereby degrading the reliability of joint under high current stressing and providing design guidance for micro-interconnect reliability.</p>

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Microstructural evolution of TLP bonding joints with high fraction of IMCs: effect on mechanical and fracture behavior under high current stressing

  • 期刊论文

  • 发表日期：

    2026年7月21日

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  • Zhanglong Ke,
  • Bo Wang,
  • Hao Dong,
  • Wei Huang,
  • Siliang He,
  • Kailin Pan

摘要

As micro-scale solder joints continue to shrink, the increasing intermetallic compound (IMC) fraction and high current density become critical factors affecting joint reliability. In this study, Cu/Sn/Cu joints with IMC fractions of 10%–50% were fabricated by varying bonding time (10 min–30 h), and tensile tests were conducted under current densities of 8 × 103–1.8 × 104 A/cm2 to investigate the coupled effects of microstructural evolution induced by IMC growth and current stressing on joint mechanical and fracture behavior. Under mechanical loading, increasing the IMC fraction improved tensile strength but promoted a ductile to brittle transition, with the critical IMC fraction experimentally identified within the range of 26.84–37.02%. Under electrical–mechanical coupled loading, current concentration overlapped with mechanically weak regions, accelerating damage initiation and failure in joints with high IMC fraction. Mechanistically, the thickened IMC layers formed during prolonged bonding impose stronger geometric constraint on the Sn matrix, decrease local stress triaxiality, and promote localized plastic flow. However, the inevitable formation of Kirkendall voids during IMC growth reduces the reliability of the joint. These results indicate that microstructural evolution induced by IMC growth changes the deformation mode from relatively uniform Sn matrix-dominated plasticity to IMC-constrained localized deformation, thereby degrading the reliability of joint under high current stressing and providing design guidance for micro-interconnect reliability.