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<p>The ultra-thin, flexible electromagnetic interference (EMI) shielding paper is crucial for miniaturization, integration, and high-power electronic devices. However, given the risks of short circuits, the exploration of robust EMI paper that can withstand excessive mechanical stress or severe conditions remains a significant challenge. Herein, a facile foam-forming method combined with in situ carbonization process for fabrication of flexible carbon/basalt hybrid paper (C@BF/CFP) with low electrical conductivity is developed in the present work. The hybrid paper features a three-dimensional (3D) uniformly porous structure and a continuous conductive pathway, resulting in excellent EMI shielding performance, high tensile strength, and superior fire-retardancy properties. Typically, C@BF/CFP-3, with a BF-to-CF weight ratio of 4:1, demonstrates shielding effectiveness greater than 68.0&#xa0;dB across the entire X-band, exhibiting low electrical conductivity of 2.01&#xa0;S/cm, a tensile strength of 90.2&#xa0;MPa, and fire-retardancy for up to 300s without ignition. It is observed that a significant portion of the incident electromagnetic wave penetrates the surface of the hybrid paper and undergoes multiple reflections and absorptions within its porous structure. The three-dimensional pore network effectively increases the residence time of the electromagnetic wave within the hybrid paper, resulting in considerable wave attenuation. This strategy offers a promising approach to designing flexible hybrid film for EMI shielding, with broad applications in next-generation electronic devices.</p> Graphical abstract <p></p>

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Flexible carbon/basalt hybrid paper with low electrical conductivity, excellent fire-retardancy, and electromagnetic interference shielding performance

  • 期刊论文

  • 发表日期：

    2026年5月17日

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  • Jiaqi Yao,
  • Xiaoqing Wen,
  • Gang Yu,
  • Yang Liu,
  • Zhigang Yang,
  • Shengjian Qin,
  • Hongya Wu,
  • Guanglei Zhang,
  • Ruilan Tian

摘要

The ultra-thin, flexible electromagnetic interference (EMI) shielding paper is crucial for miniaturization, integration, and high-power electronic devices. However, given the risks of short circuits, the exploration of robust EMI paper that can withstand excessive mechanical stress or severe conditions remains a significant challenge. Herein, a facile foam-forming method combined with in situ carbonization process for fabrication of flexible carbon/basalt hybrid paper (C@BF/CFP) with low electrical conductivity is developed in the present work. The hybrid paper features a three-dimensional (3D) uniformly porous structure and a continuous conductive pathway, resulting in excellent EMI shielding performance, high tensile strength, and superior fire-retardancy properties. Typically, C@BF/CFP-3, with a BF-to-CF weight ratio of 4:1, demonstrates shielding effectiveness greater than 68.0 dB across the entire X-band, exhibiting low electrical conductivity of 2.01 S/cm, a tensile strength of 90.2 MPa, and fire-retardancy for up to 300s without ignition. It is observed that a significant portion of the incident electromagnetic wave penetrates the surface of the hybrid paper and undergoes multiple reflections and absorptions within its porous structure. The three-dimensional pore network effectively increases the residence time of the electromagnetic wave within the hybrid paper, resulting in considerable wave attenuation. This strategy offers a promising approach to designing flexible hybrid film for EMI shielding, with broad applications in next-generation electronic devices.

Graphical abstract