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<p>Epoxy resin (EP) composites with high thermal conductivity are critically important for effective thermal management in modern electronics. However, their development is often hindered by the intrinsically low thermal conductivity of epoxy. In this study, a vertically aligned, neuron-mimetic three-dimensional graphene nanoribbon–carbon nanotube/carbon (GNR–CNT/C) foam was fabricated through gel compression and carbonization of a GNR–CNT/carboxymethyl chitosan (CMCS) hybrid aerogel. This rationally engineered architecture promotes directional phonon transport while substantially reducing interfacial thermal resistance (ITR). After epoxy infiltration, the resulting GNR–CNT/C/EP composite exhibits a high out-plane thermal conductivity of 6.79 W·m⁻<sup>1</sup>·K⁻<sup>1</sup> at a low filler loading of 2.43 vol%, yielding an exceptional thermal conductivity enhancement (TCE) of 1356%. The composite also demonstrates moderate electrical conductivity, with a volume resistivity of 1.04 × 10<sup>3</sup> Ω·cm, and superior mechanical performance—compressive strength reaches 147.26&#xa0;MPa, a 76% improvement over neat EP. Combined experimental and theoretical analyses reveal that the multidimensionally continuous and oriented heat transfer pathways within the GNR–CNT/C foam effectively mitigate interfacial phonon scattering. This work provides a feasible and scalable route for designing high-performance thermal interface materials with integrated multifunctional attributes for advanced thermal management.</p>

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High thermal conductivity of epoxy composites enabled by vertically aligned GNR–CNT/C foam with a neuron-mimetic architecture

  • 期刊论文

  • 发表日期：

    2026年7月24日

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  • Jin Wang,
  • Zongwen Qiao,
  • Chunyue Zheng,
  • Zhengyan Chen

摘要

Epoxy resin (EP) composites with high thermal conductivity are critically important for effective thermal management in modern electronics. However, their development is often hindered by the intrinsically low thermal conductivity of epoxy. In this study, a vertically aligned, neuron-mimetic three-dimensional graphene nanoribbon–carbon nanotube/carbon (GNR–CNT/C) foam was fabricated through gel compression and carbonization of a GNR–CNT/carboxymethyl chitosan (CMCS) hybrid aerogel. This rationally engineered architecture promotes directional phonon transport while substantially reducing interfacial thermal resistance (ITR). After epoxy infiltration, the resulting GNR–CNT/C/EP composite exhibits a high out-plane thermal conductivity of 6.79 W·m⁻1·K⁻1 at a low filler loading of 2.43 vol%, yielding an exceptional thermal conductivity enhancement (TCE) of 1356%. The composite also demonstrates moderate electrical conductivity, with a volume resistivity of 1.04 × 103 Ω·cm, and superior mechanical performance—compressive strength reaches 147.26 MPa, a 76% improvement over neat EP. Combined experimental and theoretical analyses reveal that the multidimensionally continuous and oriented heat transfer pathways within the GNR–CNT/C foam effectively mitigate interfacial phonon scattering. This work provides a feasible and scalable route for designing high-performance thermal interface materials with integrated multifunctional attributes for advanced thermal management.