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<p>To investigate the wear process of silicon carbide (SiC) abrasive grains during the precision grinding of quartz wafers under dry friction conditions, this study simplifies the damage modes of SiC abrasive grains and develops an experimental model for surface grinding damage induced by quartz wafers on SiC grains. By integrating friction force curves with changes in surface morphology, the surface damage characteristics of SiC grains are examined. The evolution of subsurface damage (SSD) within the workpiece is investigated by analyzing the lattice phase transformation and dislocation evolution inside SiC. Synthesizing the evolution patterns of both subsurface and surface damage, the damage evolution mechanism of SiC abrasive grains is elucidated. Analysis indicates that at a grinding speed of 100&#xa0;m/s, the process is dominated by surface wear, representing the most favorable condition for grinding. At this speed, the internal damage of SiC initially expands in a “flower-like” pattern under the applied load. As grinding proceeds, the petal-like expansions coalesce, and the damage propagates inward along the grinding trajectory. The leading-edge damage exhibits a conical failure mode, while the region behind the cone displays a horizontal damage pattern. This study provides a reference for further improving the grinding quality of quartz wafers and for the optimal design of SiC grinding plates.</p>

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Lattice damage evolution of silicon carbide abrasives under dry friction: a molecular dynamics study

  • 期刊论文

  • 发表日期：

    2026年4月15日

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  • Xiaowei Feng,
  • Liangyu Zhu,
  • Yang Hu,
  • Weiwen Hu,
  • Hong Jiang,
  • Nanxing Wu

摘要

To investigate the wear process of silicon carbide (SiC) abrasive grains during the precision grinding of quartz wafers under dry friction conditions, this study simplifies the damage modes of SiC abrasive grains and develops an experimental model for surface grinding damage induced by quartz wafers on SiC grains. By integrating friction force curves with changes in surface morphology, the surface damage characteristics of SiC grains are examined. The evolution of subsurface damage (SSD) within the workpiece is investigated by analyzing the lattice phase transformation and dislocation evolution inside SiC. Synthesizing the evolution patterns of both subsurface and surface damage, the damage evolution mechanism of SiC abrasive grains is elucidated. Analysis indicates that at a grinding speed of 100 m/s, the process is dominated by surface wear, representing the most favorable condition for grinding. At this speed, the internal damage of SiC initially expands in a “flower-like” pattern under the applied load. As grinding proceeds, the petal-like expansions coalesce, and the damage propagates inward along the grinding trajectory. The leading-edge damage exhibits a conical failure mode, while the region behind the cone displays a horizontal damage pattern. This study provides a reference for further improving the grinding quality of quartz wafers and for the optimal design of SiC grinding plates.