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<p>In present paper, diffusion bonding process and uniaxial tensile behaviors of the Inconel 625 alloy bonded joint are investigated by molecular dynamics simulations, and the correlation between bonding parameters and strength of the joint is elucidated. Then, the cross-scale correlations are proposed to bridge the time and strength related discrepancies between macroscopic and microscopic systems. The results illustrate that as the bonding temperature increases, the width of diffusion zone at the bonding interface increases progressively, resulting in the tensile strength increases, 1403&#xa0;K is determined to be the optimal bonding temperature. With the increasing of bonding pressure, the tensile strength increases, 14&#xa0;MPa is identified as the optimal bonding pressure. When the holding time reaches 4&#xa0;ns, the tensile strength reaches its maximum value of 13.52&#xa0;GPa. Based on the established cross-scale correlation between macroscopic and microscopic systems, the corresponding optimal macroscopic scale bonding parameters are determined as <i>T</i> = 1403&#xa0;K, <i>P</i> = 14&#xa0;MPa, and <i>t</i> = 87.3&#xa0;min, yielding a predicted joint tensile strength of 884.82&#xa0;MPa. This investigation provides a theoretical guidance for selection and optimization of diffusion bonding parameters.</p>

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Cross-scale correlation of diffusion bonding parameters for Inconel 625 alloy bonded joint based on molecular dynamics simulations

  • 期刊论文

  • 发表日期：

    2026年1月29日

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  • Yu-Cai Zhang,
  • Xiangyu He,
  • Wenchun Jiang,
  • Shan-Tung Tu,
  • Xian-Cheng Zhang

摘要

In present paper, diffusion bonding process and uniaxial tensile behaviors of the Inconel 625 alloy bonded joint are investigated by molecular dynamics simulations, and the correlation between bonding parameters and strength of the joint is elucidated. Then, the cross-scale correlations are proposed to bridge the time and strength related discrepancies between macroscopic and microscopic systems. The results illustrate that as the bonding temperature increases, the width of diffusion zone at the bonding interface increases progressively, resulting in the tensile strength increases, 1403 K is determined to be the optimal bonding temperature. With the increasing of bonding pressure, the tensile strength increases, 14 MPa is identified as the optimal bonding pressure. When the holding time reaches 4 ns, the tensile strength reaches its maximum value of 13.52 GPa. Based on the established cross-scale correlation between macroscopic and microscopic systems, the corresponding optimal macroscopic scale bonding parameters are determined as T = 1403 K, P = 14 MPa, and t = 87.3 min, yielding a predicted joint tensile strength of 884.82 MPa. This investigation provides a theoretical guidance for selection and optimization of diffusion bonding parameters.