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<p>With the continuous increase in power density of electronic devices, traditional cooling technologies face severe challenges in high heat flux scenarios. Phase Change Materials (PCMs) have shown great potential in electronic packaging thermal management due to their high latent heat capacity and passive temperature control characteristics. This review summarizes the classifications of PCMs, strategies for performance optimization, and their recent advances in electronic packaging applications. It also examines effective strategies for enhancing thermal conductivity and cycling stability, such as incorporating highly conductive fillers, microencapsulation, encapsulation within porous matrices, and polymer cross-linking. Studies indicate that composite PCMs offer significant advantages in addressing leakage issues and improving interfacial heat transfer. However, challenges including high modulus and large interfacial thermal resistance continue to hinder their practical application. Future research should focus on material innovation and stability enhancement to develop efficient and lightweight thermal solutions for electronics. This review provides theoretical insights and practical guidance for developing and optimizing high-performance PCMs.</p>

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Research progress on the application of phase change materials in thermal management for electronic packaging

  • 期刊论文

  • 发表日期：

    2026年1月21日

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  • Chunxiao Song,
  • Yang Ma,
  • Xuechi Wang,
  • Xiaoliang Ji,
  • Yishu Wang,
  • Fusheng Li,
  • Fu Guo

摘要

With the continuous increase in power density of electronic devices, traditional cooling technologies face severe challenges in high heat flux scenarios. Phase Change Materials (PCMs) have shown great potential in electronic packaging thermal management due to their high latent heat capacity and passive temperature control characteristics. This review summarizes the classifications of PCMs, strategies for performance optimization, and their recent advances in electronic packaging applications. It also examines effective strategies for enhancing thermal conductivity and cycling stability, such as incorporating highly conductive fillers, microencapsulation, encapsulation within porous matrices, and polymer cross-linking. Studies indicate that composite PCMs offer significant advantages in addressing leakage issues and improving interfacial heat transfer. However, challenges including high modulus and large interfacial thermal resistance continue to hinder their practical application. Future research should focus on material innovation and stability enhancement to develop efficient and lightweight thermal solutions for electronics. This review provides theoretical insights and practical guidance for developing and optimizing high-performance PCMs.