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<p>In this study, the characteristics of the grain boundaries of β-Sn grains in micro-Cu-pillar/Sn–Ag–Cu solder/Cu-pad joints were investigated through {110} and {100} pole figure analyses and Euler mapping. The twist and tilt grain boundaries and the corresponding rotation axis were identified, and the contour separation method and axis distribution analysis were employed to calculate the twisting and tilting angles, which were determined to be 38.54° ± 0.90° with rotation axis of &lt; <InlineEquation ID="IEq1"> <EquationSource Format="TEX">\(\overline{2 }\overline{3 }\)</EquationSource> <EquationSource Format="MATHML"><math> <mrow> <mover> <mn>2</mn> <mo>¯</mo> </mover> <mover> <mn>3</mn> <mo>¯</mo> </mover> </mrow> </math></EquationSource> </InlineEquation>0 &gt; (Δ = 2.38° ± 0.08°) and 56.22° ± 0.27°with rotation axis of &lt; 041 &gt; (Δ = 3.82° ± 0.09°), respectively. The twist grain boundaries exhibited rapid migration toward the outer surfaces of the micro-solder bumps and eventually disappeared during aging. By contrast, the tilt grain boundary remained stable after 75&#xa0;h of aging at 140&#xa0;℃, extending transversely through the solder bump. In addition, the stable tilt grain boundary was determined to be a twin grain boundary with a &lt; 041 &gt; axis and a {101} twin plane. The shift of the rotation axis in the {101} twin from the &lt; 010 &gt; direction can be identified by the &lt; 041 &gt; pole figure with shift angle of 7.9° ± 2.5° (Δ = 3.82° ± 0.09°); however, the {101} twinning plane still remains.</p> Graphical abstract <p></p>

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Determination and characteristics of β-Sn twin boundaries in Sn–Ag–Cu micro-solder joints

  • 期刊论文

  • 发表日期：

    2026年1月8日

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  • Chieh-Pu Tsai,
  • Zhong-Yen Yu,
  • Liu-Hsin-Chen Yang,
  • Chih-En Hsu,
  • Kai-Chi Lin,
  • Chih-Wen Chiu,
  • Chung-Yu Chiu,
  • Jui-Shen Chang,
  • Chen-Nan Chiu,
  • David T. Chu,
  • Yao-Chun Chuang,
  • Cheng-Yi Liu

摘要

In this study, the characteristics of the grain boundaries of β-Sn grains in micro-Cu-pillar/Sn–Ag–Cu solder/Cu-pad joints were investigated through {110} and {100} pole figure analyses and Euler mapping. The twist and tilt grain boundaries and the corresponding rotation axis were identified, and the contour separation method and axis distribution analysis were employed to calculate the twisting and tilting angles, which were determined to be 38.54° ± 0.90° with rotation axis of <  \(\overline{2 }\overline{3 }\) 2 ¯ 3 ¯ 0 > (Δ = 2.38° ± 0.08°) and 56.22° ± 0.27°with rotation axis of < 041 > (Δ = 3.82° ± 0.09°), respectively. The twist grain boundaries exhibited rapid migration toward the outer surfaces of the micro-solder bumps and eventually disappeared during aging. By contrast, the tilt grain boundary remained stable after 75 h of aging at 140 ℃, extending transversely through the solder bump. In addition, the stable tilt grain boundary was determined to be a twin grain boundary with a < 041 > axis and a {101} twin plane. The shift of the rotation axis in the {101} twin from the < 010 > direction can be identified by the < 041 > pole figure with shift angle of 7.9° ± 2.5° (Δ = 3.82° ± 0.09°); however, the {101} twinning plane still remains.

Graphical abstract