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<p>Lotus-type porous Cu with different porosities (37, 42, and 47%) was bonded to Al₂O₃ using active metal brazing. Bonding was carried out using a Cu-Sn-Ti paste, followed by heating in a vacuum atmosphere up to 880 °C and holding for 10 min. The microstructure, mechanical properties, and thermal shock resistance of the joints were investigated. The infiltration of filler metal into directional pores was observed at the lotus-type porous Cu/Al<sub>2</sub>O<sub>3</sub> joint. Lotus-type porous Cu joint exhibited lower shear strength compared to that of non-porous Cu joint, but demonstrated greater displacement at failure. After thermal shock testing, significant degradation was not observed in the lotus-type porous Cu/Al₂O₃ joint, whereas cracks formed at the edge of Al₂O₃ in the non-porous Cu/Al₂O₃ joint. Moreover, higher estimated residual stresses were calculated at the ceramic interface in the non-porous Cu joint compared to the lotus-type porous Cu joint.</p>

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Active metal brazing of lotus-type porous Cu to Al2O3 substrate using Cu-Sn-Ti alloy

  • 期刊论文

  • 发表日期：

    2025年12月22日

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  • Seung-Min Cho,
  • Keun-Soo Kim,
  • Jin-Kwan Lee,
  • Hong-Seok Kim,
  • Sang-Wook Kim,
  • Soong-Keun Hyun

摘要

Lotus-type porous Cu with different porosities (37, 42, and 47%) was bonded to Al₂O₃ using active metal brazing. Bonding was carried out using a Cu-Sn-Ti paste, followed by heating in a vacuum atmosphere up to 880 °C and holding for 10 min. The microstructure, mechanical properties, and thermal shock resistance of the joints were investigated. The infiltration of filler metal into directional pores was observed at the lotus-type porous Cu/Al2O3 joint. Lotus-type porous Cu joint exhibited lower shear strength compared to that of non-porous Cu joint, but demonstrated greater displacement at failure. After thermal shock testing, significant degradation was not observed in the lotus-type porous Cu/Al₂O₃ joint, whereas cracks formed at the edge of Al₂O₃ in the non-porous Cu/Al₂O₃ joint. Moreover, higher estimated residual stresses were calculated at the ceramic interface in the non-porous Cu joint compared to the lotus-type porous Cu joint.