Precipitate enveloping effect and its influence on the corrosion resistance of Cu–Ti alloys prepared by accumulative roll bonding-deformation aging process
摘要
Cu–Ti alloys were prepared by accumulative roll bonding-deformation aging (ARB-DA) process. The electrochemical corrosion behavior was compared with accumulative roll bonding-diffusion heat treatment and aging (ARB-DHTA) alloys, and the corrosion resistance mechanism was revealed. The results show that deeper pits exist on ARB-DHTAed Cu–Ti alloy surfaces with the corrosion time prolongation. ARB-DAed Cu–Ti alloys have relatively flat surfaces, higher film resistance and lower dimensional passivation current density. Length of the passivation interval is about twice longer than that of ARB-DHTAed alloys. Precipitates and special grain boundaries (SGBs) affect corrosion resistance. High-density dispersive nano-precipitates detach from the matrix and attach to the ARB-DAed alloy surface in the initial corrosion stage. Precipitates increase as the corrosion process proceeds, and wrap around the surface to form a dense protective film. As a result, an “enveloping effect” reduces the corrosion rate of Cl− and improves the passivation effect effectively with SGBs.