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<p>This study fabricated Cu–W alloys with varying Ti contents (with a W content of 8 wt%) using mechanical alloying combined with spark plasma sintering. The relative density of the alloys reaches as high as 97.6%. Through a combination of physical and mechanical property testing, along with FE-SEM, XRD, EDS, EBSD and TEM analyses, the influences of Ti content on the microscopic structure and performance of Cu–Ti–W alloy was investigated. Results indicated that during sintering, Cu<sub>0.4</sub>W<sub>0.6</sub>, Ti<sub>0.5</sub>W<sub>0.5</sub>, and Cu<sub>0.75</sub>Ti<sub>0.25</sub> solid solutions were formed. These solid solutions effectively inhibited grain boundary migration, while an appropriate Ti addition significantly refined the Cu grains. With increasing Ti content, the electrical conductivity of the alloy exhibited a monotonic decrease. The tensile strength, compressive strength and hardness were significantly improved to 470&#xa0;MPa, 1209&#xa0;MPa, and 129 HV, which was respectively 43.3%, 31.5% and 33.0% higher than the Cu–W alloy without adding Ti. The improvement in mechanical properties is primarily attributed to the synergistic effect of multiple solid solution phases and the inherent ability of Ti to impede the migration of Cu grain boundaries and dislocations. This work provides valuable insights for the design and development of high-performance Cu–W alloys.</p>

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Microstructure and property of Cu–Ti–W alloy taking into account the influence of Ti content

  • 期刊论文

  • 发表日期：

    2025年9月19日

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  • Haiyang Pei,
  • Xiuqing Li,
  • Yucheng Zhou,
  • Zengye Ning,
  • Qingxia Yang,
  • Shizhong Wei,
  • Liujie Xu

摘要

This study fabricated Cu–W alloys with varying Ti contents (with a W content of 8 wt%) using mechanical alloying combined with spark plasma sintering. The relative density of the alloys reaches as high as 97.6%. Through a combination of physical and mechanical property testing, along with FE-SEM, XRD, EDS, EBSD and TEM analyses, the influences of Ti content on the microscopic structure and performance of Cu–Ti–W alloy was investigated. Results indicated that during sintering, Cu0.4W0.6, Ti0.5W0.5, and Cu0.75Ti0.25 solid solutions were formed. These solid solutions effectively inhibited grain boundary migration, while an appropriate Ti addition significantly refined the Cu grains. With increasing Ti content, the electrical conductivity of the alloy exhibited a monotonic decrease. The tensile strength, compressive strength and hardness were significantly improved to 470 MPa, 1209 MPa, and 129 HV, which was respectively 43.3%, 31.5% and 33.0% higher than the Cu–W alloy without adding Ti. The improvement in mechanical properties is primarily attributed to the synergistic effect of multiple solid solution phases and the inherent ability of Ti to impede the migration of Cu grain boundaries and dislocations. This work provides valuable insights for the design and development of high-performance Cu–W alloys.