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<p>This study systematically explores the incorporation of nickel (Ni) and zinc (Zn) into Sn-Cu solder alloys to enhance microstructural and mechanical properties, aiming to improve reliability in electronic applications. Advanced characterization techniques, including X-ray diffraction (XRD), optical microscopy (OM), scanning electron microscopy (SEM), and pulse-echo overlap (PEO) analysis, were employed to examine the evolution of microstructure, the formation of intermetallic compounds (IMCs), and the elastic properties of Sn-0.7Cu solder alloys. The addition of Ni and Zn significantly improved the primary β-Sn matrix, resulting in a homogeneous and fine-grained structure. The formation of (Cu,Ni)₆Sn₅ and Cu₅Zn₈ intermetallic compounds, uniformly distributed within the Sn matrix, contributed to alloy strengthening by impeding dislocation motion and enhancing resistance to plastic deformation. The microstructural refinement of the Sn-0.7Cu alloy led to a notable increase in its elastic moduli, systematically measured using PEO characterization. Young's modulus (E) showed a 14.0% increase, while shear (G), bulk (K), and longitudinal (L) moduli improved by 6.06%, 11.5%, and 10.57%, respectively. These significant improvements are attributed to the superior hardness of the (Cu, Ni)₆Sn₅ and Cu₅Zn₈ intermetallic compounds (IMCs), which surpass the Sn-rich matrix and drive grain boundary strengthening induced by the intermetallic compounds. DSC analyses revealed a slight reduction in melting temperature (~ 2–3&#xa0;°C), attributed to IMCs promoting heterogeneous nucleation during solidification, resulting in improved grain structure and suppression of large β-Sn phase formation. These advancements position the Sn-0.7Cu-0.05Ni-2.0Zn alloy as a highly reliable candidate for critical electronic applications, such as high-power devices and miniaturized circuits, where mechanical integrity under thermal and mechanical stress is of utmost importance.</p> Graphical abstract <p></p>

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Ni/Zn additions in Sn–Cu solder: enhanced elasticity and reliability via intermetallic strengthening

  • 期刊论文

  • 发表日期：

    2025年6月7日

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  • M. Ragab,
  • A. M. El-Taher,
  • M. Amin,
  • K. B. Mashaly,
  • H. N. Soliman

摘要

This study systematically explores the incorporation of nickel (Ni) and zinc (Zn) into Sn-Cu solder alloys to enhance microstructural and mechanical properties, aiming to improve reliability in electronic applications. Advanced characterization techniques, including X-ray diffraction (XRD), optical microscopy (OM), scanning electron microscopy (SEM), and pulse-echo overlap (PEO) analysis, were employed to examine the evolution of microstructure, the formation of intermetallic compounds (IMCs), and the elastic properties of Sn-0.7Cu solder alloys. The addition of Ni and Zn significantly improved the primary β-Sn matrix, resulting in a homogeneous and fine-grained structure. The formation of (Cu,Ni)₆Sn₅ and Cu₅Zn₈ intermetallic compounds, uniformly distributed within the Sn matrix, contributed to alloy strengthening by impeding dislocation motion and enhancing resistance to plastic deformation. The microstructural refinement of the Sn-0.7Cu alloy led to a notable increase in its elastic moduli, systematically measured using PEO characterization. Young's modulus (E) showed a 14.0% increase, while shear (G), bulk (K), and longitudinal (L) moduli improved by 6.06%, 11.5%, and 10.57%, respectively. These significant improvements are attributed to the superior hardness of the (Cu, Ni)₆Sn₅ and Cu₅Zn₈ intermetallic compounds (IMCs), which surpass the Sn-rich matrix and drive grain boundary strengthening induced by the intermetallic compounds. DSC analyses revealed a slight reduction in melting temperature (~ 2–3 °C), attributed to IMCs promoting heterogeneous nucleation during solidification, resulting in improved grain structure and suppression of large β-Sn phase formation. These advancements position the Sn-0.7Cu-0.05Ni-2.0Zn alloy as a highly reliable candidate for critical electronic applications, such as high-power devices and miniaturized circuits, where mechanical integrity under thermal and mechanical stress is of utmost importance.

Graphical abstract