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<p>A ceramic composite was synthesized using β-CaSiO<sub>3</sub> (wollastonite) with perovskite additives and an Al<sub>2</sub>O<sub>3</sub>–CuO–Li<sub>2</sub>CO<sub>3</sub> sintering aid. This study examines the influence of sintering additives on the ceramic and dielectric properties of both CaSiO<sub>3</sub>/Al<sub>2</sub>O<sub>3</sub>–CuO–Li<sub>2</sub>CO<sub>3</sub> and CaSiO<sub>3</sub>/CaTiO<sub>3</sub>–Al<sub>2</sub>O<sub>3</sub>–CuO–Li<sub>2</sub>CO<sub>3</sub> systems. The thermal conductivity λ of the obtained samples ranged from 0.43 to 0.65 W/(m ∙ K), which is characteristic of wollastonite ceramics. The relative dielectric permittivity ε<sub><i>r</i></sub> ranged from 4.9 to 8.0, the dielectric loss tangent (tan δ) was (15.3–17.9) × 10 <sup>–3</sup> at a frequency <i>f</i> of 1 MHz, and the average density ρ<sub>av</sub> was 2.44 – 2.63 g/cm<sup>3</sup>. Sintering was carried out at temperatures ranging from 875 to 950°C. The combination of these properties, along with low thermal conductivity λ, meets the criteria for thermally stable ceramic packages and substrates used in low-temperature co-fired ceramic (LTCC) microelectronics applications.</p>

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Low-Temperature Ceramics Based on Wollastonite and Perovskite Modified with Al2O3–CuO–Li2CO3 for LTCC Technology

  • 期刊论文

  • 发表日期：

    2025年11月13日

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  • D. S. Voloschuk,
  • V. V. Anisimov,
  • N. A. Makarov

摘要

A ceramic composite was synthesized using β-CaSiO3 (wollastonite) with perovskite additives and an Al2O3–CuO–Li2CO3 sintering aid. This study examines the influence of sintering additives on the ceramic and dielectric properties of both CaSiO3/Al2O3–CuO–Li2CO3 and CaSiO3/CaTiO3–Al2O3–CuO–Li2CO3 systems. The thermal conductivity λ of the obtained samples ranged from 0.43 to 0.65 W/(m ∙ K), which is characteristic of wollastonite ceramics. The relative dielectric permittivity εr ranged from 4.9 to 8.0, the dielectric loss tangent (tan δ) was (15.3–17.9) × 10 –3 at a frequency f of 1 MHz, and the average density ρav was 2.44 – 2.63 g/cm3. Sintering was carried out at temperatures ranging from 875 to 950°C. The combination of these properties, along with low thermal conductivity λ, meets the criteria for thermally stable ceramic packages and substrates used in low-temperature co-fired ceramic (LTCC) microelectronics applications.